SCHEMBL26606107

SCHEMBL26606107

Cc1ccc(NC(=O)Nc2cccc(-c3cc(C)ccc3S(=O)(=O)O)c2)cc1

nearest known ligand 0.54

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ CNR1 P21554 9/20 0.54
▸ NPC1 O15118 1/20 0.52
▸ RAB9A P51151 1/20 0.52
▸ KDR P35968 2/20 0.51
▸ SAE1 Q9UBE0 1/20 0.48
▸ UBA2 Q9UBT2 1/20 0.48
▸ CSF1R P07333 1/20 0.47
▸ FLT1 P17948 1/20 0.47
▸ FLT3 P36888 1/20 0.47
▸ KMT2A Q03164 2/20 0.46
▸ PKM P14618 1/20 0.46
▸ SMN1; SMN2 Q16637 1/20 0.46
▸ MEN1 O00255 1/20 0.46
▸ LMNA P02545 1/20 0.46
▸ TP53 P04637 1/20 0.46
▸ POLB P06746 1/20 0.46
▸ MAPT P10636 1/20 0.46
▸ XBP1 P17861 1/20 0.46
▸ ALOX12 P18054 1/20 0.46
▸ HTT P42858 1/20 0.46

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL21810519 0.95 MGLL (0.52) CNR1NPC1RAB9AKDRKMT2A
SCHEMBL26605998 0.94 CNR1 (0.52) CNR1NPC1RAB9AKDRSAE1
SCHEMBL21810508 0.90 CNR1 (0.55) CNR1NPC1RAB9AKDRKMT2A
SCHEMBL26605995 0.90 SAE1 (0.54) CNR1NPC1RAB9AKDRSAE1
SCHEMBL26606078 0.90 CNR1 (0.57) CNR1NPC1RAB9AKDRSAE1
SCHEMBL26606047 0.88 PTPN7 (0.50) NPC1RAB9AKDRFLT3KMT2A
SCHEMBL20393981 0.87 LMNA (0.58) RAB9AKMT2AMEN1LMNATP53
SCHEMBL26606036 0.87 DDX3X (0.59) CNR1NPC1RAB9AKDRFLT1
SCHEMBL26606060 0.87 CXCR2 (0.50) NPC1RAB9AKDRCSF1RFLT1
SCHEMBL26606056 0.86 CNR1 (0.53) CNR1NPC1RAB9AKDRSAE1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4269119-A1 COLOR DEVELOPER, HEAT-SENSITIVE RECORDING MATERIAL, AND COATING MATERIAL FOR HEAT-SENSITIVE RECORDING LAYERS Sanko Co., Ltd. (JP) 2023-11-01 — — EP disclosed
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