SCHEMBL26606047

SCHEMBL26606047

Cc1ccc(NC(=O)Nc2ccc(-c3cc(C)ccc3S(=O)(=O)O)cc2)cc1

nearest known ligand 0.51

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ PTPN7 P35236 1/20 0.50
▸ KDR P35968 4/20 0.45
▸ NPC1 O15118 5/20 0.44
▸ RAB9A P51151 5/20 0.44
▸ ALDH1A1 P00352 3/20 0.44
▸ MAPT P10636 1/20 0.44
▸ HPSE Q9Y251 1/20 0.44
▸ KIF11 P52732 1/20 0.44
▸ ENPP2 Q13822 1/20 0.44
▸ SMN1; SMN2 Q16637 2/20 0.43
▸ MEN1 O00255 2/20 0.43
▸ LMNA P02545 2/20 0.43
▸ KMT2A Q03164 2/20 0.43
▸ POLB P06746 1/20 0.43
▸ CA12 O43570 1/20 0.43
▸ CA1 P00915 1/20 0.43
▸ CA2 P00918 1/20 0.43
▸ CA9 Q16790 1/20 0.43
▸ HTT P42858 1/20 0.43
▸ L3MBTL1 Q9Y468 1/20 0.43

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL26606060 0.93 CXCR2 (0.50) KDRNPC1RAB9AALDH1A1MAPT
SCHEMBL26605995 0.91 SAE1 (0.54) KDRNPC1RAB9ASMN1; SMN2KMT2A
SCHEMBL26606107 0.88 CNR1 (0.54) PTPN7KDRNPC1RAB9AMAPT
SCHEMBL26606079 0.88 DDX3X (0.51) KDRNPC1RAB9AMAPTSMN1; SMN2
SCHEMBL1117961 0.86 PTGS2 (0.42) ALDH1A1MAPTMEN1KMT2APOLB
SCHEMBL26606032 0.86 NAMPT (0.55) PTPN7KDRNPC1RAB9AMAPT
SCHEMBL8082279 0.84 MAOA (0.41) ALDH1A1MAPTMEN1KMT2APOLB
SCHEMBL21810519 0.83 MGLL (0.52) KDRNPC1RAB9AALDH1A1MAPT
SCHEMBL26606017 0.83 CXCR2 (0.51) PTPN7NPC1RAB9AALDH1A1MAPT
SCHEMBL26605998 0.81 CNR1 (0.52) KDRNPC1RAB9AALDH1A1MAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4269119-A1 COLOR DEVELOPER, HEAT-SENSITIVE RECORDING MATERIAL, AND COATING MATERIAL FOR HEAT-SENSITIVE RECORDING LAYERS Sanko Co., Ltd. (JP) 2023-11-01 — — EP disclosed
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