SCHEMBL2681600

SCHEMBL2681600

CCCOC(=O)C(C)(CC)C(F)(F)F

nearest known ligand 0.34

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
HCAR2 Q8TDS4 1/20 0.34
ALDH1A1 P00352 3/20 0.33
LMNA P02545 1/20 0.32
CES2 O00748 1/20 0.32
ESR1 P03372 1/20 0.32
CHRM1 P11229 1/20 0.32
TSHR P16473 1/20 0.32
SLC6A2 P23975 1/20 0.32
KDR P35968 1/20 0.32
TDP1 Q9NUW8 1/20 0.32
RAB9A P51151 1/20 0.30
GRM1 Q13255 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2680750 0.89 ALDH1A1 (0.45) HCAR2ALDH1A1LMNACES2ESR1
SCHEMBL2680747 0.87 NAAA (0.44) HCAR2ALDH1A1LMNACES2TSHR
SCHEMBL2680865 0.85 NAAA (0.47) HCAR2ALDH1A1LMNACES2TSHR
SCHEMBL2680863 0.85 NAAA (0.47) HCAR2ALDH1A1LMNACES2TSHR
SCHEMBL3408327 0.83 CYP4F2 (0.40) ALDH1A1LMNATSHR
SCHEMBL13799360 0.83 CYP4F2 (0.39) ALDH1A1
SCHEMBL17773371 0.83 FFAR3 (0.32) ALDH1A1
SCHEMBL3410070 0.82 CA1 (0.35) ALDH1A1LMNATDP1
SCHEMBL14803921 0.82
SCHEMBL13641996 0.80 CHRM2 (0.50) LMNACHRM1TSHRRAB9A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 21 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9482945-B2 Photoresist compositions and methods of forming photolithographic patterns ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) 2016-11-01 US disclosed
US-20160103393-A1 PHOTORESIST COMPOSITIONS AND METHODS OF FORMING PHOTOLITHOGRAPHIC PATTERNS U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT 2016-04-14 US disclosed
US-9158198-B2 Photoresist compositions and methods of forming photolithographic patterns ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) 2015-10-13 US disclosed
EP-1795962-B1 Positive resist composition and pattern for forming method using the same FUJIFILM CORP (JP) 2014-02-12 EP disclosed
US-8632938-B2 Actinic-ray- or radiation-sensitive resin composition and method of forming pattern using the composition FUJIFILM CORPORATION (JP) 2014-01-21 US disclosed
US-8632938-B2 Actinic-ray- or radiation-sensitive resin composition and method of forming pattern using the composition FUJIFILM CORPORATION (JP) 2014-01-21 US disclosed
US-20120249995-A1 RESIST PROTECTIVE FILM MATERIAL AND PATTERN FORMATION METHOD SHIN-ETSU CHEMICAL CO. LTD. (JP) 2012-10-04 US disclosed
US-8158330-B2 Resist protective coating composition and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2012-04-17 US disclosed
US-8101335-B2 Resist composition and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2012-01-24 US disclosed
US-8088537-B2 Resist top coat composition and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2012-01-03 US disclosed
US-7771912-B2 Positive resist composition and pattern forming method using the same FUJIFILM CORPORATION (JP) 2010-08-10 US disclosed
US-7642034-B2 Photoresists; (meth)acrylate fluoropolymer which is insoluble in water, dissolvable in aqueous alkaline solution, and immiscible with resist films so that it enables pattern formation by the immersion lithography SHIN-ETSU CHEMICAL CO., LTD. (JP) 2010-01-05 US disclosed
US-20090286182-A1 RESIST PROTECTIVE COATING COMPOSITION AND PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2009-11-19 US disclosed
US-20090280434-A1 RESIST COMPOSITION AND PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2009-11-12 US disclosed
US-20070178407-A1 Polymer, resist protective coating material, and patterning process SHIN-ETSU CHEMICAL CO., LTD. 2007-08-02 US disclosed
US-20070134589-A1 Positive resist composition and pattern forming method using the same FUJIFILM CORPORATION (JP) 2007-06-14 US disclosed
US-20070134589-A1 Positive resist composition and pattern forming method using the same FUJIFILM CORPORATION (JP) 2007-06-14 US disclosed
EP-1795962-A2 Positive resist composition and pattern for forming method using the same Fujifilm Corporation (JP) 2007-06-13 EP disclosed
US-20070122736-A1 RESIST PROTECTIVE FILM MATERIAL AND PATTERN FORMATION METHOD SHIN-ETSU CHEMICAL CO., LTD. 2007-05-31 US disclosed
US-20070122741-A1 Resist protective coating material and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2007-05-31 US disclosed