SCHEMBL2685758

SCHEMBL2685758

CCCCCCOC(=O)OC1(C(CC)CCCC)OO1

nearest known ligand 0.44

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
NAAA Q02083 1/20 0.40
EPHX1 P07099 1/20 0.38
PLA2G2C Q5R387 1/20 0.38
TSHR P16473 3/20 0.37
HCAR2 Q8TDS4 1/20 0.36
RAD52 P43351 1/20 0.36
NPSR1 Q6W5P4 1/20 0.36
CA1 P00915 1/20 0.35
CA2 P00918 1/20 0.35
FAAH O00519 1/20 0.35
ALDH1A1 P00352 1/20 0.35
LMNA P02545 1/20 0.35
ACHE P22303 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8368535 0.94 ALDH1A1 (0.38) NAAATSHRHCAR2NPSR1CA1
SCHEMBL220715 0.78 CTSK (0.36) CA1CA2
SCHEMBL8823364 0.75 CA2 (0.39) TSHRNPSR1CA1CA2LMNA
SCHEMBL1835519 0.70 NAAA (0.67) NAAAEPHX1TSHRHCAR2RAD52
SCHEMBL1839030 0.70 NAAA (0.67) NAAAEPHX1TSHRHCAR2RAD52
SCHEMBL1834574 0.70 NAAA (0.67) NAAAEPHX1TSHRHCAR2RAD52
SCHEMBL1837444 0.70 NAAA (0.67) NAAAEPHX1TSHRHCAR2RAD52
SCHEMBL119774 0.70 NAAA (0.67) NAAAEPHX1TSHRHCAR2RAD52
SCHEMBL1838958 0.70 NAAA (0.67) NAAAEPHX1TSHRHCAR2RAD52
SCHEMBL1839498 0.70 NAAA (0.67) NAAAEPHX1TSHRHCAR2RAD52

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240110030-A1 EXPANDABLE RESIN PARTICLE, EXPANDED RESIN PARTICLE, FOAMED RESIN MOLDED ARTICLE AND MANUFACTURING METHOD THEREOF LCY Chemical Corp. (TW) 2024-04-04 US disclosed
EP-4345116-A1 EXPANDABLE RESIN PARTICLE, EXPANDED RESIN PARTICLE, FOAMED RESIN MOLDED ARTICLE AND MANUFACTURING METHOD THEREOF LCY Chemical Corp. (TW) 2024-04-03 EP disclosed
CN-117777610-A Foamable and foamable resin particles, foamed resin molded article, and process for producing the same 李长荣化学工业股份有限公司 2024-03-29 CN disclosed
CN-115873363-A Molded body and impact absorbing material 株式会社JSP 2023-03-31 CN disclosed
CN-108623831-B Composite resin particles and composite resin foamed particles 株式会社JSP 2022-02-11 CN disclosed
CN-107365424-B Composite resin expanded particle, method for producing same, and composite resin expanded particle molded body 株式会社JSP 2021-09-14 CN disclosed
CN-106009359-B Panel packaging container 株式会社JSP 2020-02-21 CN disclosed
CN-105384959-A Expandable composite resin bead JSP CORP 2016-03-09 CN disclosed
US-9000060-B2 Expandable modified resin beads, expanded modified resin beads, and foamed molded article formed from expanded modified resin beads JSP CORPORATION (JP) 2015-04-07 US disclosed
US-20140249240-A1 EXPANDABLE MODIFIED RESIN BEADS, EXPANDED MODIFIED RESIN BEADS, AND FOAMED MOLDED ARTICLE FORMED FROM EXPANDED MODIFIED RESIN BEADS JSP CORPORATION (JP) 2014-09-04 US disclosed
US-8592495-B2 Thermoplastic resin composite bead production method, expandable thermoplastic resin composite bead, expanded thermoplastic resin composite bead, and foamed molded article formed from expanded thermoplastic resin composite beads JSP CORPORATION (JP) 2013-11-26 US disclosed
US-20120149792-A1 EXPANDABLE MODIFIED RESIN BEADS, EXPANDED MODIFIED RESIN BEADS, AND FOAMED MOLDED ARTICLE FORMED FROM EXPANDED MODIFIED RESIN BEADS JSP CORPORATION (JP) 2012-06-14 US disclosed
US-20120115968-A1 THERMOPLASTIC RESIN COMPOSITE BEAD PRODUCTION METHOD, EXPANDABLE THERMOPLASTIC RESIN COMPOSITE BEAD, EXPANDED THERMOPLASTIC RESIN COMPOSITE BEAD, AND FOAMED MOLDED ARTICLE FORMED FROM EXPANDED THERMOPLASTIC RESIN COMPOSITE BEADS JSP CORPORATION (JP) 2012-05-10 US disclosed