SCHEMBL2701951

SCHEMBL2701951

CCCO[C](C)c1ccccc1

nearest known ligand 0.62

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
LMNA P02545 2/20 0.62
ALDH1A1 P00352 6/20 0.48
HPGD P15428 4/20 0.47
GAA P10253 2/20 0.42
SMN1; SMN2 Q16637 1/20 0.42
TDP1 Q9NUW8 2/20 0.41
ESR1 P03372 1/20 0.41
CHRM1 P11229 1/20 0.41
TSHR P16473 1/20 0.41
SLC6A2 P23975 1/20 0.41
KDR P35968 1/20 0.41
ELANE P08246 1/20 0.41
KMT2A Q03164 2/20 0.41
HTT P42858 2/20 0.40
MEN1 O00255 1/20 0.40
MAPT P10636 1/20 0.40
THRB P10828 1/20 0.40
MAPK1 P28482 1/20 0.39
L3MBTL1 Q9Y468 1/20 0.39
CES2 O00748 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL17844755 0.83 ALDH1A1 (0.45) LMNAALDH1A1GAATDP1TSHR
SCHEMBL2122417 0.82 MEN1 (0.48) LMNAALDH1A1GAASMN1; SMN2TSHR
SCHEMBL2253649 0.80 LMNA (0.64) LMNAALDH1A1HPGDGAASMN1; SMN2
SCHEMBL1449661 0.80 LMNA (0.64) LMNAALDH1A1HPGDGAASMN1; SMN2
SCHEMBL27957193 0.77 LMNA (0.60) LMNAALDH1A1HPGDGAASMN1; SMN2
SCHEMBL6057354 0.77 LMNA (0.66) LMNAALDH1A1HPGDGAASMN1; SMN2
SCHEMBL7682290 0.77 LMNA (0.60) LMNAALDH1A1HPGDGAASMN1; SMN2
SCHEMBL130761 0.77 LMNA (1.00) LMNAALDH1A1HPGDSMN1; SMN2TDP1
SCHEMBL3286254 0.77 LMNA (0.60) LMNAALDH1A1HPGDGAASMN1; SMN2
SCHEMBL7181498 0.77 LMNA (1.00) LMNAALDH1A1HPGDSMN1; SMN2TDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2447773-B1 Method for producing a pattern, method for producing a MEMS structure, use of a cured film of a photosensitive composition as a sacrificial layer or as a component of a MEMS structure FUJIFILM CORP (JP) 2013-07-10 EP disclosed
US-20120107563-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERN, MEMS STRUCTURE, METHOD FOR PRODUCING THE STRUCTURE, METHOD FOR DRY ETCHING, METHOD FOR WET ETCHING, MEMS SHUTTER DEVICE, AND IMAGE DISPLAY APPARATUS FUJIFILM CORPORATION (JP) 2012-05-03 US disclosed
EP-2447773-A1 Photosensitive resin composition, method for producing pattern, MEMS structure, method for producing the structure, method for dry etching, method for wet etching, MEMS shutter device, and image display apparatus Fujifilm Corporation (JP) 2012-05-02 EP disclosed