SCHEMBL2707654

SCHEMBL2707654

O=C(O)c1ccc(C#CC2C3CC4CC(C3)CC2C4)c(C(=O)O)c1

nearest known ligand 0.36

Predicted protein targets (top 6)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 1/20 0.36
HSD11B1 P28845 11/20 0.34
L3MBTL1 Q9Y468 1/20 0.33
STS P08842 1/20 0.32
PTPN1 P18031 1/20 0.32
PRSS12 P56730 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2710897 0.89 KDM4E (0.36) KDM4EHSD11B1L3MBTL1STSPTPN1
SCHEMBL2709577 0.78 FFAR1 (0.37) KDM4EHSD11B1
SCHEMBL2707946 0.76 STS (0.34) KDM4ESTS
SCHEMBL2706953 0.75 STS (0.40) KDM4ESTS
SCHEMBL2708226 0.75 KDM4E (0.33) KDM4EHSD11B1L3MBTL1
SCHEMBL2708869 0.75 HSD11B1 (0.33) HSD11B1L3MBTL1
SCHEMBL2709828 0.74 HNF4A (0.39) HSD11B1L3MBTL1
SCHEMBL2709279 0.73 MMP13 (0.36) HSD11B1L3MBTL1PTPN1
SCHEMBL2707880 0.72
SCHEMBL2707858 0.70 SERPINE1 (0.47) KDM4ESTS

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2000510-B1 RESIN COMPOSITION, VARNISH, RESIN FILM, AND SEMICONDUCTOR DEVICE USING THE RESIN FILM SUMITOMO BAKELITE CO (JP) 2012-05-02 EP disclosed
US-7863347-B2 Resin composition, varnish, resin film and semiconductor device using the same SUMITOMO BAKELITE COMPANY, LTD. (JP) 2011-01-04 US disclosed
US-7652125-B2 Resin composition, polyimide resin composition, polybenzoxazole resin composition, varnish, resin film and semiconductor device using the same SUMITOMO BAKELITE COMPANY, LTD. (JP) 2010-01-26 US disclosed
US-20090118431-A1 RESIN COMPOSITION, VARNISH, RESIN FILM AND SEMICONDUCTOR DEVICE USING THE SAME SUMITOMO BAKELITE COMPANY, LTD (JP) 2009-05-07 US disclosed
EP-2000510-A1 RESIN COMPOSITION, VARNISH, RESIN FILM, AND SEMICONDUCTOR DEVICE USING THE RESIN FILM Sumitomo Bakelite Company, Ltd. (JP) 2008-12-10 EP disclosed
US-20080255335-A1 Resin Composition, Polyimide Resin Composition, Polybenzoxazole Resin Composition, Varnish, Resin Film and Semiconductor Device Using the Same SUMITOMO BAKELITE COMPANY LTD. (JP) 2008-10-16 US disclosed
EP-1813637-A1 RESIN COMPOSITION, POLYIMIDE RESIN COMPOSITION, POLY- BENZOXAZOLE RESIN COMPOSITION, VARNISHES, RESIN FILMS AND SEMICONDUCTOR DEVICES MADE BY USING THE SAME Sumitomo Bakelite Company, Limited (JP) 2007-08-01 EP disclosed