SCHEMBL2709577

SCHEMBL2709577

O=C(O)c1ccc(C#Cc2ccc(C3C4CC5CC(C4)CC3C5)cc2)c(C(=O)O)c1

nearest known ligand 0.37

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
FFAR1 O14842 7/20 0.37
RARB P10826 2/20 0.34
RARG P13631 2/20 0.34
CYP26A1 O43174 1/20 0.34
CYP3A4 P08684 1/20 0.34
RARA P10276 1/20 0.34
CRABP2 P29373 1/20 0.34
HSD11B1 P28845 3/20 0.33
HNF4A P41235 1/20 0.33
PTPN11 Q06124 1/20 0.33
SLC16A3 O15427 2/20 0.32
KDM4E B2RXH2 1/20 0.32
NPC1 O15118 1/20 0.31
RAB9A P51151 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2709279 0.93 MMP13 (0.36) FFAR1RARBRARGCYP26A1CYP3A4
SCHEMBL2707815 0.90 FFAR1 (0.37) FFAR1RARBRARGCYP26A1CYP3A4
SCHEMBL2707894 0.84 MMP13 (0.36) FFAR1RARBRARGCYP26A1CYP3A4
SCHEMBL2710464 0.82 P2RY14 (0.41) FFAR1RARBRARGCYP26A1CYP3A4
SCHEMBL2709679 0.81 HNF4A (0.43) FFAR1RARBRARGCYP26A1CYP3A4
SCHEMBL2707764 0.79 RARB (0.39) FFAR1RARBRARGCYP26A1CYP3A4
SCHEMBL2707654 0.78 KDM4E (0.36) HSD11B1KDM4E
SCHEMBL2710072 0.78 FFAR1 (0.39) FFAR1HNF4ASLC16A3KDM4ENPC1
SCHEMBL2707858 0.78 SERPINE1 (0.47) RARBRARGCYP26A1CYP3A4RARA
SCHEMBL2709664 0.76 MMP13 (0.38) FFAR1RARBRARGCYP26A1CYP3A4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2000510-B1 RESIN COMPOSITION, VARNISH, RESIN FILM, AND SEMICONDUCTOR DEVICE USING THE RESIN FILM SUMITOMO BAKELITE CO (JP) 2012-05-02 EP disclosed
US-7863347-B2 Resin composition, varnish, resin film and semiconductor device using the same SUMITOMO BAKELITE COMPANY, LTD. (JP) 2011-01-04 US disclosed
US-7652125-B2 Resin composition, polyimide resin composition, polybenzoxazole resin composition, varnish, resin film and semiconductor device using the same SUMITOMO BAKELITE COMPANY, LTD. (JP) 2010-01-26 US disclosed
US-20090118431-A1 RESIN COMPOSITION, VARNISH, RESIN FILM AND SEMICONDUCTOR DEVICE USING THE SAME SUMITOMO BAKELITE COMPANY, LTD (JP) 2009-05-07 US disclosed
EP-2000510-A1 RESIN COMPOSITION, VARNISH, RESIN FILM, AND SEMICONDUCTOR DEVICE USING THE RESIN FILM Sumitomo Bakelite Company, Ltd. (JP) 2008-12-10 EP disclosed
US-20080255335-A1 Resin Composition, Polyimide Resin Composition, Polybenzoxazole Resin Composition, Varnish, Resin Film and Semiconductor Device Using the Same SUMITOMO BAKELITE COMPANY LTD. (JP) 2008-10-16 US disclosed
EP-1813637-A1 RESIN COMPOSITION, POLYIMIDE RESIN COMPOSITION, POLY- BENZOXAZOLE RESIN COMPOSITION, VARNISHES, RESIN FILMS AND SEMICONDUCTOR DEVICES MADE BY USING THE SAME Sumitomo Bakelite Company, Limited (JP) 2007-08-01 EP disclosed