SCHEMBL2708795

SCHEMBL2708795

O=C(O)c1cc(C#Cc2ccc(Oc3ccc(C45CC6CC(CC(C6)C4)C5)cc3)cc2)cc(C(=O)O)c1

nearest known ligand 0.49

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
HIF1A Q16665 14/20 0.49
EPAS1 Q99814 6/20 0.49
MEN1 O00255 2/20 0.48
KMT2A Q03164 2/20 0.48
RAB9A P51151 1/20 0.48
LMNA P02545 2/20 0.44
ALDH1A1 P00352 1/20 0.44
L3MBTL1 Q9Y468 1/20 0.44
MDH2 P40926 2/20 0.41
MMP13 P45452 1/20 0.40
CASP2 P42575 1/20 0.40
MDH1 P40925 1/20 0.40
EP300 Q09472 1/20 0.40
SERPINE1 P05121 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2709569 0.92 HIF1A (0.46) HIF1AEPAS1MEN1KMT2ARAB9A
SCHEMBL2707830 0.84 HIF1A (0.47) HIF1AEPAS1MEN1KMT2ARAB9A
SCHEMBL2709090 0.84 RARB (0.40) HIF1AEPAS1MMP13
SCHEMBL2710156 0.84 HIF1A (0.48) HIF1AEPAS1MEN1KMT2ARAB9A
SCHEMBL2710141 0.84 HIF1A (0.48) HIF1AEPAS1MEN1KMT2ARAB9A
SCHEMBL19362904 0.83 MEN1 (0.55) HIF1AEPAS1MEN1KMT2ARAB9A
SCHEMBL2709694 0.80 RARB (0.40) MEN1KMT2ALMNAMMP13
SCHEMBL2709664 0.78 MMP13 (0.38) MEN1KMT2AMMP13
SCHEMBL2709552 0.78 HIF1A (0.48) HIF1AEPAS1MEN1KMT2ARAB9A
SCHEMBL2707051 0.76 SERPINE1 (0.47) HIF1AEPAS1MEN1KMT2ARAB9A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2000510-B1 RESIN COMPOSITION, VARNISH, RESIN FILM, AND SEMICONDUCTOR DEVICE USING THE RESIN FILM SUMITOMO BAKELITE CO (JP) 2012-05-02 EP disclosed
US-7863347-B2 Resin composition, varnish, resin film and semiconductor device using the same SUMITOMO BAKELITE COMPANY, LTD. (JP) 2011-01-04 US disclosed
US-7652125-B2 Resin composition, polyimide resin composition, polybenzoxazole resin composition, varnish, resin film and semiconductor device using the same SUMITOMO BAKELITE COMPANY, LTD. (JP) 2010-01-26 US disclosed
US-20090118431-A1 RESIN COMPOSITION, VARNISH, RESIN FILM AND SEMICONDUCTOR DEVICE USING THE SAME SUMITOMO BAKELITE COMPANY, LTD (JP) 2009-05-07 US disclosed
EP-2000510-A1 RESIN COMPOSITION, VARNISH, RESIN FILM, AND SEMICONDUCTOR DEVICE USING THE RESIN FILM Sumitomo Bakelite Company, Ltd. (JP) 2008-12-10 EP disclosed
US-20080255335-A1 Resin Composition, Polyimide Resin Composition, Polybenzoxazole Resin Composition, Varnish, Resin Film and Semiconductor Device Using the Same SUMITOMO BAKELITE COMPANY LTD. (JP) 2008-10-16 US disclosed
EP-1813637-A1 RESIN COMPOSITION, POLYIMIDE RESIN COMPOSITION, POLY- BENZOXAZOLE RESIN COMPOSITION, VARNISHES, RESIN FILMS AND SEMICONDUCTOR DEVICES MADE BY USING THE SAME Sumitomo Bakelite Company, Limited (JP) 2007-08-01 EP disclosed