SCHEMBL2709552

SCHEMBL2709552

O=C(O)c1cccc(C#Cc2ccc(Oc3ccc(C45CC6CC(CC(C6)C4)C5)cc3)cc2)c1C(=O)O

nearest known ligand 0.48

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
HIF1A Q16665 11/20 0.48
EPAS1 Q99814 5/20 0.48
MEN1 O00255 2/20 0.43
KMT2A Q03164 2/20 0.43
RAB9A P51151 1/20 0.43
LMNA P02545 2/20 0.37
ALDH1A1 P00352 1/20 0.37
L3MBTL1 Q9Y468 1/20 0.37
SERPINE1 P05121 2/20 0.36
CASP2 P42575 1/20 0.36
KDM4E B2RXH2 1/20 0.36
EPHX2 P34913 1/20 0.35
NPC1 O15118 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2709267 0.93 HIF1A (0.46) HIF1AEPAS1MEN1KMT2ARAB9A
SCHEMBL2710076 0.86 HIF1A (0.36) HIF1AEPAS1MEN1KMT2ARAB9A
SCHEMBL2707916 0.82 FFAR1 (0.36) HIF1AEPAS1KDM4EEPHX2
SCHEMBL2707830 0.81 HIF1A (0.47) HIF1AEPAS1MEN1KMT2ARAB9A
SCHEMBL2708832 0.81 FFAR1 (0.35) RAB9ANPC1
SCHEMBL2710141 0.81 HIF1A (0.48) HIF1AEPAS1MEN1KMT2ARAB9A
SCHEMBL2710156 0.81 HIF1A (0.48) HIF1AEPAS1MEN1KMT2ARAB9A
SCHEMBL2706663 0.79 PGR (0.35) HIF1AEPAS1RAB9AEPHX2NPC1
SCHEMBL2708795 0.78 HIF1A (0.49) HIF1AEPAS1MEN1KMT2ARAB9A
SCHEMBL2710139 0.76 FFAR1 (0.39) RAB9AKDM4EEPHX2NPC1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2000510-B1 RESIN COMPOSITION, VARNISH, RESIN FILM, AND SEMICONDUCTOR DEVICE USING THE RESIN FILM SUMITOMO BAKELITE CO (JP) 2012-05-02 EP disclosed
US-7863347-B2 Resin composition, varnish, resin film and semiconductor device using the same SUMITOMO BAKELITE COMPANY, LTD. (JP) 2011-01-04 US disclosed
US-7652125-B2 Resin composition, polyimide resin composition, polybenzoxazole resin composition, varnish, resin film and semiconductor device using the same SUMITOMO BAKELITE COMPANY, LTD. (JP) 2010-01-26 US disclosed
US-20090118431-A1 RESIN COMPOSITION, VARNISH, RESIN FILM AND SEMICONDUCTOR DEVICE USING THE SAME SUMITOMO BAKELITE COMPANY, LTD (JP) 2009-05-07 US disclosed
EP-2000510-A1 RESIN COMPOSITION, VARNISH, RESIN FILM, AND SEMICONDUCTOR DEVICE USING THE RESIN FILM Sumitomo Bakelite Company, Ltd. (JP) 2008-12-10 EP disclosed
US-20080255335-A1 Resin Composition, Polyimide Resin Composition, Polybenzoxazole Resin Composition, Varnish, Resin Film and Semiconductor Device Using the Same SUMITOMO BAKELITE COMPANY LTD. (JP) 2008-10-16 US disclosed
EP-1813637-A1 RESIN COMPOSITION, POLYIMIDE RESIN COMPOSITION, POLY- BENZOXAZOLE RESIN COMPOSITION, VARNISHES, RESIN FILMS AND SEMICONDUCTOR DEVICES MADE BY USING THE SAME Sumitomo Bakelite Company, Limited (JP) 2007-08-01 EP disclosed