SCHEMBL2709138

SCHEMBL2709138

O=C(O)c1ccc(Oc2ccc(C3C4CC5CC(C4)CC3C5)c(Oc3ccc(C(=O)O)c(C(=O)O)c3)c2C2C3CC4CC(C3)CC2C4)cc1C(=O)O

nearest known ligand 0.39

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
POLB P06746 2/20 0.39
KDM4E B2RXH2 1/20 0.39
PYGL P06737 13/20 0.37
PYGM P11217 8/20 0.36
HPSE Q9Y251 1/20 0.36
ALDH1A1 P00352 1/20 0.35
GALK1 P51570 1/20 0.33
CASP6 P55212 1/20 0.33
MCL1 Q07820 1/20 0.33
PLEC Q15149 1/20 0.33
TDP1 Q9NUW8 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28078771 0.84 POLB (0.44) POLBKDM4EPYGLPYGMHPSE
SCHEMBL27971743 0.82 PYGL (0.37) POLBKDM4EPYGLPYGMHPSE
SCHEMBL2708206 0.79 MMP2 (0.34)
SCHEMBL2709190 0.79 CHRNB2 (0.34) POLB
SCHEMBL2708804 0.78 POLB (0.39) POLBKDM4EPYGLPYGMHPSE
SCHEMBL2708497 0.76 SLC6A2 (0.43) POLB
SCHEMBL28308668 0.70 POLB (0.47) POLBKDM4EPYGLPYGMHPSE
SCHEMBL27946716 0.69 POLB (0.54) POLBKDM4EPYGLPYGMHPSE
SCHEMBL16046931 0.68 RARB (0.46) POLBKDM4EPYGLPYGMHPSE
SCHEMBL2709745 0.67 POLB (0.49) POLBKDM4EPYGLPYGMHPSE

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2000510-B1 RESIN COMPOSITION, VARNISH, RESIN FILM, AND SEMICONDUCTOR DEVICE USING THE RESIN FILM SUMITOMO BAKELITE CO (JP) 2012-05-02 EP disclosed
US-7863347-B2 Resin composition, varnish, resin film and semiconductor device using the same SUMITOMO BAKELITE COMPANY, LTD. (JP) 2011-01-04 US disclosed
US-7652125-B2 Resin composition, polyimide resin composition, polybenzoxazole resin composition, varnish, resin film and semiconductor device using the same SUMITOMO BAKELITE COMPANY, LTD. (JP) 2010-01-26 US disclosed
US-20090118431-A1 RESIN COMPOSITION, VARNISH, RESIN FILM AND SEMICONDUCTOR DEVICE USING THE SAME SUMITOMO BAKELITE COMPANY, LTD (JP) 2009-05-07 US disclosed
EP-2000510-A1 RESIN COMPOSITION, VARNISH, RESIN FILM, AND SEMICONDUCTOR DEVICE USING THE RESIN FILM Sumitomo Bakelite Company, Ltd. (JP) 2008-12-10 EP disclosed
US-20080255335-A1 Resin Composition, Polyimide Resin Composition, Polybenzoxazole Resin Composition, Varnish, Resin Film and Semiconductor Device Using the Same SUMITOMO BAKELITE COMPANY LTD. (JP) 2008-10-16 US disclosed
EP-1813637-A1 RESIN COMPOSITION, POLYIMIDE RESIN COMPOSITION, POLY- BENZOXAZOLE RESIN COMPOSITION, VARNISHES, RESIN FILMS AND SEMICONDUCTOR DEVICES MADE BY USING THE SAME Sumitomo Bakelite Company, Limited (JP) 2007-08-01 EP disclosed