SCHEMBL2708804

SCHEMBL2708804

O=C(O)c1ccc(Oc2ccc(C3C4CC5CC(C4)CC3C5)cc2-c2cc(C3C4CC5CC(C4)CC3C5)ccc2Oc2ccc(C(=O)O)c(C(=O)O)c2)cc1C(=O)O

nearest known ligand 0.39

Predicted protein targets (top 6)

geneUniProtsupporting neighboursconfidence
POLB P06746 2/20 0.39
PYGL P06737 14/20 0.39
KDM4E B2RXH2 1/20 0.39
PYGM P11217 11/20 0.38
ALDH1A1 P00352 1/20 0.38
HPSE Q9Y251 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2710730 0.85 HSD11B1 (0.41) ALDH1A1
SCHEMBL28078771 0.82 POLB (0.44) POLBPYGLKDM4EPYGMALDH1A1
SCHEMBL28308668 0.78 POLB (0.47) POLBPYGLKDM4EPYGMALDH1A1
SCHEMBL2709273 0.78 MMP2 (0.36)
SCHEMBL2711010 0.76 CHRNB2 (0.35) POLB
SCHEMBL2708799 0.76 HIF1A (0.43) POLBPYGLKDM4EPYGMALDH1A1
SCHEMBL27971743 0.75 PYGL (0.37) POLBPYGLKDM4EPYGMALDH1A1
SCHEMBL3179550 0.73 SLC6A2 (0.42)
SCHEMBL23290133 0.71 ACMSD (0.49) POLBPYGLKDM4EPYGMALDH1A1
SCHEMBL21628861 0.71 LMNA (0.46)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2000510-B1 RESIN COMPOSITION, VARNISH, RESIN FILM, AND SEMICONDUCTOR DEVICE USING THE RESIN FILM SUMITOMO BAKELITE CO (JP) 2012-05-02 EP disclosed
US-7863347-B2 Resin composition, varnish, resin film and semiconductor device using the same SUMITOMO BAKELITE COMPANY, LTD. (JP) 2011-01-04 US disclosed
US-7652125-B2 Resin composition, polyimide resin composition, polybenzoxazole resin composition, varnish, resin film and semiconductor device using the same SUMITOMO BAKELITE COMPANY, LTD. (JP) 2010-01-26 US disclosed
US-20090118431-A1 RESIN COMPOSITION, VARNISH, RESIN FILM AND SEMICONDUCTOR DEVICE USING THE SAME SUMITOMO BAKELITE COMPANY, LTD (JP) 2009-05-07 US disclosed
EP-2000510-A1 RESIN COMPOSITION, VARNISH, RESIN FILM, AND SEMICONDUCTOR DEVICE USING THE RESIN FILM Sumitomo Bakelite Company, Ltd. (JP) 2008-12-10 EP disclosed
US-20080255335-A1 Resin Composition, Polyimide Resin Composition, Polybenzoxazole Resin Composition, Varnish, Resin Film and Semiconductor Device Using the Same SUMITOMO BAKELITE COMPANY LTD. (JP) 2008-10-16 US disclosed
EP-1813637-A1 RESIN COMPOSITION, POLYIMIDE RESIN COMPOSITION, POLY- BENZOXAZOLE RESIN COMPOSITION, VARNISHES, RESIN FILMS AND SEMICONDUCTOR DEVICES MADE BY USING THE SAME Sumitomo Bakelite Company, Limited (JP) 2007-08-01 EP disclosed