SCHEMBL2709265

SCHEMBL2709265

Nc1ccc(Oc2ccc(C34CC5CC(CC(C5)C3)C4)cc2-c2cc(C34CC5CC(CC(C5)C3)C4)ccc2Oc2ccc(N)c(O)c2)cc1O

nearest known ligand 0.48

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KMT2A Q03164 5/20 0.48
MEN1 O00255 4/20 0.48
GAA P10253 3/20 0.48
POLB P06746 1/20 0.48
GFER P55789 1/20 0.48
ALDH1A1 P00352 4/20 0.41
LMNA P02545 2/20 0.41
RAB9A P51151 1/20 0.40
L3MBTL1 Q9Y468 2/20 0.39
CNR2 P34972 3/20 0.38
MMP2 P08253 1/20 0.36
MMP14 P50281 1/20 0.36
HIF1A Q16665 6/20 0.35
EPAS1 Q99814 3/20 0.35
MDH1 P40925 1/20 0.34
MDH2 P40926 1/20 0.34
EP300 Q09472 1/20 0.34
MAPT P10636 2/20 0.34
KDM4E B2RXH2 1/20 0.34
THRB P10828 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3191103 0.90 MEN1 (0.39) KMT2AMEN1GAAPOLBGFER
SCHEMBL5086572 0.85 MEN1 (0.50) KMT2AMEN1GAAPOLBGFER
SCHEMBL2730836 0.85 EPHX2 (0.34) KMT2AMEN1GAAPOLBGFER
SCHEMBL2708118 0.83 ALDH1A1 (0.58) KMT2AMEN1GAAPOLBGFER
SCHEMBL2711005 0.82 KMT2A (0.47) KMT2AMEN1GAAPOLBGFER
SCHEMBL2707238 0.81 MEN1 (0.40) KMT2AMEN1GAAPOLBGFER
SCHEMBL2707241 0.81 MEN1 (0.44) KMT2AMEN1GAAPOLBGFER
SCHEMBL2707709 0.81 MEN1 (0.38) KMT2AMEN1GAAPOLBGFER
SCHEMBL2710593 0.78 ESR1 (0.48) KMT2AMEN1GAAPOLBGFER
SCHEMBL2708799 0.77 HIF1A (0.43) KMT2AMEN1GAAPOLBGFER

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2000510-B1 RESIN COMPOSITION, VARNISH, RESIN FILM, AND SEMICONDUCTOR DEVICE USING THE RESIN FILM SUMITOMO BAKELITE CO (JP) 2012-05-02 EP disclosed
US-7863347-B2 Resin composition, varnish, resin film and semiconductor device using the same SUMITOMO BAKELITE COMPANY, LTD. (JP) 2011-01-04 US disclosed
US-7652125-B2 Resin composition, polyimide resin composition, polybenzoxazole resin composition, varnish, resin film and semiconductor device using the same SUMITOMO BAKELITE COMPANY, LTD. (JP) 2010-01-26 US disclosed
US-20090118431-A1 RESIN COMPOSITION, VARNISH, RESIN FILM AND SEMICONDUCTOR DEVICE USING THE SAME SUMITOMO BAKELITE COMPANY, LTD (JP) 2009-05-07 US disclosed
EP-2000510-A1 RESIN COMPOSITION, VARNISH, RESIN FILM, AND SEMICONDUCTOR DEVICE USING THE RESIN FILM Sumitomo Bakelite Company, Ltd. (JP) 2008-12-10 EP disclosed
US-20080255335-A1 Resin Composition, Polyimide Resin Composition, Polybenzoxazole Resin Composition, Varnish, Resin Film and Semiconductor Device Using the Same SUMITOMO BAKELITE COMPANY LTD. (JP) 2008-10-16 US disclosed
EP-1813637-A1 RESIN COMPOSITION, POLYIMIDE RESIN COMPOSITION, POLY- BENZOXAZOLE RESIN COMPOSITION, VARNISHES, RESIN FILMS AND SEMICONDUCTOR DEVICES MADE BY USING THE SAME Sumitomo Bakelite Company, Limited (JP) 2007-08-01 EP disclosed