SCHEMBL2707709

SCHEMBL2707709

Nc1ccc(Oc2cc(Oc3ccc(N)c(O)c3)c(C34CC5CC(CC(C5)C3)C4)cc2C23CC4CC(CC(C4)C2)C3)cc1O

nearest known ligand 0.47

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MEN1 O00255 7/20 0.38
KMT2A Q03164 7/20 0.38
GAA P10253 3/20 0.38
POLB P06746 1/20 0.38
GFER P55789 1/20 0.38
MMP2 P08253 1/20 0.38
MMP14 P50281 1/20 0.38
ALDH1A1 P00352 4/20 0.36
RARB P10826 4/20 0.36
MAPT P10636 3/20 0.36
RARA P10276 3/20 0.36
RARG P13631 3/20 0.36
KDM4E B2RXH2 2/20 0.36
HPGD P15428 2/20 0.36
ALOX15 P16050 2/20 0.36
ALOX12 P18054 2/20 0.36
HSD17B10 Q99714 2/20 0.36
THRB P10828 2/20 0.36
L3MBTL1 Q9Y468 2/20 0.36
TP53 P04637 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3185036 0.89 MMP2 (0.33) MEN1KMT2AGAAPOLBGFER
SCHEMBL2707983 0.84 PTPN11 (0.36) MMP2MMP14
SCHEMBL2708132 0.83 MEN1 (0.38) MEN1KMT2AGAAPOLBGFER
SCHEMBL2708150 0.83 MEN1 (0.37) MEN1KMT2AGAAPOLBGFER
SCHEMBL2707687 0.81 ALDH1A1 (0.50) MEN1KMT2AGAAPOLBGFER
SCHEMBL2709184 0.81 FAAH (0.39) MEN1KMT2AGAAPOLBGFER
SCHEMBL5086572 0.81 MEN1 (0.50) MEN1KMT2AGAAPOLBGFER
SCHEMBL2709265 0.81 KMT2A (0.48) MEN1KMT2AGAAPOLBGFER
SCHEMBL2710589 0.80 MMP2 (0.35) MEN1KMT2AGAAPOLBGFER
SCHEMBL2708126 0.78 RARA (0.33) MEN1KMT2AALDH1A1RARBRARA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 17 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118373991-A Polyimide with high silicon content and preparation method and application thereof 深圳市摩码克来沃化学科技有限公司 2024-07-23 CN claimed
CN-118027402-A Corona-resistant polyimide, preparation method thereof and insulated wire 深圳市摩码克来沃化学科技有限公司 2024-05-14 CN claimed
CN-117186399-A Polymer, polymer film and preparation method thereof 华为技术有限公司 2023-12-08 CN claimed
CN-116239988-A Adhesive, and preparation method and application thereof 安徽壹石通材料科学研究院有限公司 2023-06-09 CN claimed
CN-115692709-A Negative electrode slurry for lithium ion battery and preparation method thereof 桂林电器科学研究院有限公司 2023-02-03 CN claimed
CN-118373991-A Polyimide with high silicon content and preparation method and application thereof 深圳市摩码克来沃化学科技有限公司 2024-07-23 CN disclosed
CN-118027402-A Corona-resistant polyimide, preparation method thereof and insulated wire 深圳市摩码克来沃化学科技有限公司 2024-05-14 CN disclosed
CN-117186399-A Polymer, polymer film and preparation method thereof 华为技术有限公司 2023-12-08 CN disclosed
CN-116239988-A Adhesive, and preparation method and application thereof 安徽壹石通材料科学研究院有限公司 2023-06-09 CN disclosed
CN-115692709-A Negative electrode slurry for lithium ion battery and preparation method thereof 桂林电器科学研究院有限公司 2023-02-03 CN disclosed
EP-2000510-B1 RESIN COMPOSITION, VARNISH, RESIN FILM, AND SEMICONDUCTOR DEVICE USING THE RESIN FILM SUMITOMO BAKELITE CO (JP) 2012-05-02 EP disclosed
US-7863347-B2 Resin composition, varnish, resin film and semiconductor device using the same SUMITOMO BAKELITE COMPANY, LTD. (JP) 2011-01-04 US disclosed
US-7652125-B2 Resin composition, polyimide resin composition, polybenzoxazole resin composition, varnish, resin film and semiconductor device using the same SUMITOMO BAKELITE COMPANY, LTD. (JP) 2010-01-26 US disclosed
US-20090118431-A1 RESIN COMPOSITION, VARNISH, RESIN FILM AND SEMICONDUCTOR DEVICE USING THE SAME SUMITOMO BAKELITE COMPANY, LTD (JP) 2009-05-07 US disclosed
EP-2000510-A1 RESIN COMPOSITION, VARNISH, RESIN FILM, AND SEMICONDUCTOR DEVICE USING THE RESIN FILM Sumitomo Bakelite Company, Ltd. (JP) 2008-12-10 EP disclosed
US-20080255335-A1 Resin Composition, Polyimide Resin Composition, Polybenzoxazole Resin Composition, Varnish, Resin Film and Semiconductor Device Using the Same SUMITOMO BAKELITE COMPANY LTD. (JP) 2008-10-16 US disclosed
EP-1813637-A1 RESIN COMPOSITION, POLYIMIDE RESIN COMPOSITION, POLY- BENZOXAZOLE RESIN COMPOSITION, VARNISHES, RESIN FILMS AND SEMICONDUCTOR DEVICES MADE BY USING THE SAME Sumitomo Bakelite Company, Limited (JP) 2007-08-01 EP disclosed