SCHEMBL2709501

SCHEMBL2709501

Nc1ccc(C23CC4CC(C2)CC(c2ccc(N)c(O)c2)(C4)C3)cc1O

nearest known ligand 0.57

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MEN1 O00255 5/20 0.57
KMT2A Q03164 5/20 0.57
POLB P06746 1/20 0.57
GAA P10253 1/20 0.57
GFER P55789 1/20 0.57
ALDH1A1 P00352 3/20 0.51
LMNA P02545 3/20 0.48
PGR P06401 2/20 0.48
GRIN2D O15399 1/20 0.42
GRIN3B O60391 1/20 0.42
GRIN1 Q05586 1/20 0.42
GRIN2A Q12879 1/20 0.42
GRIN2B Q13224 1/20 0.42
GRIN2C Q14957 1/20 0.42
GRIN3A Q8TCU5 1/20 0.42
NPC1 O15118 1/20 0.42
RAB9A P51151 1/20 0.42
RAD52 P43351 1/20 0.40
HTT P42858 1/20 0.40
SMN1; SMN2 Q16637 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2708128 0.87 MEN1 (0.57) MEN1KMT2APOLBGAAGFER
SCHEMBL31544676 0.87 MEN1 (0.57) MEN1KMT2APOLBGAAGFER
SCHEMBL1972365 0.84 MEN1 (0.79) MEN1KMT2APOLBGAAGFER
SCHEMBL2710593 0.84 ESR1 (0.48) MEN1KMT2APOLBGAAGFER
SCHEMBL29518428 0.80 PGR (0.48) MEN1KMT2APOLBGAAGFER
SCHEMBL5000706 0.80 MEN1 (0.53) MEN1KMT2APOLBGAAGFER
SCHEMBL3977955 0.78 MEN1 (0.59) MEN1KMT2APOLBGAAGFER
SCHEMBL4991468 0.78 ALDH1A1 (0.44) MEN1KMT2APOLBGAAGFER
SCHEMBL2710586 0.78 ALDH1A1 (0.44) MEN1KMT2APOLBGAAGFER
SCHEMBL3975212 0.77 MEN1 (0.57) MEN1KMT2APOLBGAAGFER

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2000510-B1 RESIN COMPOSITION, VARNISH, RESIN FILM, AND SEMICONDUCTOR DEVICE USING THE RESIN FILM SUMITOMO BAKELITE CO (JP) 2012-05-02 EP disclosed
US-7863347-B2 Resin composition, varnish, resin film and semiconductor device using the same SUMITOMO BAKELITE COMPANY, LTD. (JP) 2011-01-04 US disclosed
US-20090118431-A1 RESIN COMPOSITION, VARNISH, RESIN FILM AND SEMICONDUCTOR DEVICE USING THE SAME SUMITOMO BAKELITE COMPANY, LTD (JP) 2009-05-07 US disclosed
EP-2000510-A1 RESIN COMPOSITION, VARNISH, RESIN FILM, AND SEMICONDUCTOR DEVICE USING THE RESIN FILM Sumitomo Bakelite Company, Ltd. (JP) 2008-12-10 EP disclosed