SCHEMBL2709811

SCHEMBL2709811

O=C(O)C1(C(=O)O)c2ccccc2-c2cccc(-c3ccccc3)c21

nearest known ligand 0.55

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ THRB P10828 1/20 0.55
▸ TDP1 Q9NUW8 1/20 0.55
▸ HNF4A P41235 1/20 0.42
▸ APEX1 P27695 1/20 0.41
▸ BCAT2 O15382 1/20 0.40
▸ PDK2 Q15119 2/20 0.38
▸ ALDH1A1 P00352 2/20 0.38
▸ HPGD P15428 1/20 0.38
▸ BCL2L1 Q07817 1/20 0.38
▸ HSD17B10 Q99714 1/20 0.38
▸ CYP2A6 P11509 1/20 0.38
▸ HDAC4 P56524 1/20 0.37
▸ HDAC2 Q92769 1/20 0.37
▸ HDAC8 Q9BY41 1/20 0.37
▸ HDAC6 Q9UBN7 1/20 0.37
▸ KMT2A Q03164 2/20 0.37
▸ MEN1 O00255 1/20 0.37
▸ SMN1; SMN2 Q16637 1/20 0.37
▸ CHRNB2 P17787 1/20 0.36
▸ CHRNB4 P30926 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL18663304 0.82 THRB (0.64) THRBTDP1APEX1PDK2ALDH1A1
SCHEMBL27497315 0.81 THRB (0.71) THRBTDP1HNF4AAPEX1BCAT2
SCHEMBL18663353 0.76 TDP1 (0.44) THRBTDP1APEX1PDK2ALDH1A1
SCHEMBL30741411 0.75 THRB (0.50) THRBTDP1HNF4AAPEX1PDK2
SCHEMBL3401845 0.75 THRB (0.50) THRBTDP1HNF4AAPEX1PDK2
SCHEMBL25818400 0.74 THRB (0.43) THRBTDP1HNF4AAPEX1PDK2
SCHEMBL18663408 0.73 THRB (0.41) THRBTDP1APEX1PDK2HDAC4
SCHEMBL18663338 0.72 THRB (0.40) THRBTDP1APEX1PDK2KMT2A
SCHEMBL11469925 0.71 THRB (1.00) THRBTDP1APEX1PDK2ALDH1A1
SCHEMBL66735 0.71 THRB (1.00) THRBTDP1APEX1PDK2ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2000510-B1 RESIN COMPOSITION, VARNISH, RESIN FILM, AND SEMICONDUCTOR DEVICE USING THE RESIN FILM SUMITOMO BAKELITE CO (JP) 2012-05-02 — — EP disclosed
US-7863347-B2 Resin composition, varnish, resin film and semiconductor device using the same SUMITOMO BAKELITE COMPANY, LTD. (JP) 2011-01-04 — — US disclosed
US-7652125-B2 Resin composition, polyimide resin composition, polybenzoxazole resin composition, varnish, resin film and semiconductor device using the same SUMITOMO BAKELITE COMPANY, LTD. (JP) 2010-01-26 — — US disclosed
US-20090118431-A1 RESIN COMPOSITION, VARNISH, RESIN FILM AND SEMICONDUCTOR DEVICE USING THE SAME SUMITOMO BAKELITE COMPANY, LTD (JP) 2009-05-07 — — US disclosed
EP-2000510-A1 RESIN COMPOSITION, VARNISH, RESIN FILM, AND SEMICONDUCTOR DEVICE USING THE RESIN FILM Sumitomo Bakelite Company, Ltd. (JP) 2008-12-10 — — EP disclosed
US-20080255335-A1 Resin Composition, Polyimide Resin Composition, Polybenzoxazole Resin Composition, Varnish, Resin Film and Semiconductor Device Using the Same SUMITOMO BAKELITE COMPANY LTD. (JP) 2008-10-16 — — US disclosed
EP-1813637-A1 RESIN COMPOSITION, POLYIMIDE RESIN COMPOSITION, POLY- BENZOXAZOLE RESIN COMPOSITION, VARNISHES, RESIN FILMS AND SEMICONDUCTOR DEVICES MADE BY USING THE SAME Sumitomo Bakelite Company, Limited (JP) 2007-08-01 — — EP disclosed
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