SCHEMBL2710072

SCHEMBL2710072

O=C(O)c1cccc(C#Cc2ccc(C3C4CC5CC(C4)CC3C5)cc2)c1C(=O)O

nearest known ligand 0.39

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
FFAR1 O14842 8/20 0.39
NPC1 O15118 2/20 0.37
RAB9A P51151 2/20 0.37
HNF4A P41235 1/20 0.33
PAX8 Q06710 7/20 0.33
SLC16A3 O15427 1/20 0.32
KDM4E B2RXH2 1/20 0.32
MEN1 O00255 1/20 0.32
LMNA P02545 1/20 0.32
MAPT P10636 1/20 0.32
CASP3 P42574 1/20 0.32
KMT2A Q03164 1/20 0.32
SMN1; SMN2 Q16637 1/20 0.32
SENP7 Q9BQF6 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2708832 0.93 FFAR1 (0.35) FFAR1NPC1RAB9APAX8
SCHEMBL2709679 0.78 HNF4A (0.43) FFAR1NPC1RAB9AHNF4APAX8
SCHEMBL2708226 0.78 KDM4E (0.33) HNF4AKDM4EKMT2A
SCHEMBL2709267 0.78 HIF1A (0.46) NPC1RAB9AKDM4EMEN1LMNA
SCHEMBL2707815 0.78 FFAR1 (0.37) FFAR1HNF4ASLC16A3KDM4E
SCHEMBL2709577 0.78 FFAR1 (0.37) FFAR1NPC1RAB9AHNF4ASLC16A3
SCHEMBL38694 0.77 NPC1 (0.59) FFAR1NPC1RAB9AHNF4AKDM4E
SCHEMBL2707916 0.75 FFAR1 (0.36) FFAR1SLC16A3KDM4E
SCHEMBL2706666 0.75 FFAR1 (0.34) FFAR1
SCHEMBL28226287 0.75 ALDH1A1 (0.48) NPC1RAB9AKDM4EMAPTKMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2000510-B1 RESIN COMPOSITION, VARNISH, RESIN FILM, AND SEMICONDUCTOR DEVICE USING THE RESIN FILM SUMITOMO BAKELITE CO (JP) 2012-05-02 EP disclosed
US-7863347-B2 Resin composition, varnish, resin film and semiconductor device using the same SUMITOMO BAKELITE COMPANY, LTD. (JP) 2011-01-04 US disclosed
US-7652125-B2 Resin composition, polyimide resin composition, polybenzoxazole resin composition, varnish, resin film and semiconductor device using the same SUMITOMO BAKELITE COMPANY, LTD. (JP) 2010-01-26 US disclosed
US-20090118431-A1 RESIN COMPOSITION, VARNISH, RESIN FILM AND SEMICONDUCTOR DEVICE USING THE SAME SUMITOMO BAKELITE COMPANY, LTD (JP) 2009-05-07 US disclosed
EP-2000510-A1 RESIN COMPOSITION, VARNISH, RESIN FILM, AND SEMICONDUCTOR DEVICE USING THE RESIN FILM Sumitomo Bakelite Company, Ltd. (JP) 2008-12-10 EP disclosed
US-20080255335-A1 Resin Composition, Polyimide Resin Composition, Polybenzoxazole Resin Composition, Varnish, Resin Film and Semiconductor Device Using the Same SUMITOMO BAKELITE COMPANY LTD. (JP) 2008-10-16 US disclosed
EP-1813637-A1 RESIN COMPOSITION, POLYIMIDE RESIN COMPOSITION, POLY- BENZOXAZOLE RESIN COMPOSITION, VARNISHES, RESIN FILMS AND SEMICONDUCTOR DEVICES MADE BY USING THE SAME Sumitomo Bakelite Company, Limited (JP) 2007-08-01 EP disclosed