SCHEMBL2709679

SCHEMBL2709679

O=C(O)c1ccc(C#Cc2ccc(C3C4CC5CC(C4)CC3C5)cc2)cc1C(=O)O

nearest known ligand 0.43

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HNF4A P41235 1/20 0.43
FFAR1 O14842 7/20 0.38
AKR1C2 P52895 1/20 0.35
AKR1C1 Q04828 1/20 0.35
CYP26A1 O43174 1/20 0.33
CYP3A4 P08684 1/20 0.33
RARA P10276 1/20 0.33
RARB P10826 1/20 0.33
RARG P13631 1/20 0.33
CRABP2 P29373 1/20 0.33
TEAD1 P28347 1/20 0.32
KDM4E B2RXH2 1/20 0.32
MEN1 O00255 1/20 0.32
NPC1 O15118 1/20 0.32
LMNA P02545 1/20 0.32
MAPT P10636 1/20 0.32
CASP3 P42574 1/20 0.32
RAB9A P51151 1/20 0.32
KMT2A Q03164 1/20 0.32
SMN1; SMN2 Q16637 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2708194 0.93 POLB (0.39) HNF4AFFAR1LMNAL3MBTL1
SCHEMBL2707815 0.83 FFAR1 (0.37) HNF4AFFAR1CYP26A1CYP3A4RARA
SCHEMBL2710464 0.82 P2RY14 (0.41) HNF4AFFAR1CYP26A1CYP3A4RARA
SCHEMBL2709577 0.81 FFAR1 (0.37) HNF4AFFAR1CYP26A1CYP3A4RARA
SCHEMBL2709828 0.80 HNF4A (0.39) HNF4AFFAR1AKR1C2AKR1C1MEN1
SCHEMBL27178395 0.78 HNF4A (0.63) HNF4AFFAR1AKR1C2AKR1C1CYP26A1
SCHEMBL2710072 0.78 FFAR1 (0.39) HNF4AFFAR1KDM4EMEN1NPC1
SCHEMBL2707894 0.78 MMP13 (0.36) FFAR1CYP26A1CYP3A4RARARARB
SCHEMBL2710763 0.76 HNF4A (0.40) HNF4AFFAR1CYP26A1CYP3A4RARA
SCHEMBL21679889 0.76 HNF4A (0.60) HNF4AAKR1C2AKR1C1CYP26A1CYP3A4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2000510-B1 RESIN COMPOSITION, VARNISH, RESIN FILM, AND SEMICONDUCTOR DEVICE USING THE RESIN FILM SUMITOMO BAKELITE CO (JP) 2012-05-02 EP disclosed
US-7863347-B2 Resin composition, varnish, resin film and semiconductor device using the same SUMITOMO BAKELITE COMPANY, LTD. (JP) 2011-01-04 US disclosed
US-7652125-B2 Resin composition, polyimide resin composition, polybenzoxazole resin composition, varnish, resin film and semiconductor device using the same SUMITOMO BAKELITE COMPANY, LTD. (JP) 2010-01-26 US disclosed
US-20090118431-A1 RESIN COMPOSITION, VARNISH, RESIN FILM AND SEMICONDUCTOR DEVICE USING THE SAME SUMITOMO BAKELITE COMPANY, LTD (JP) 2009-05-07 US disclosed
EP-2000510-A1 RESIN COMPOSITION, VARNISH, RESIN FILM, AND SEMICONDUCTOR DEVICE USING THE RESIN FILM Sumitomo Bakelite Company, Ltd. (JP) 2008-12-10 EP disclosed
US-20080255335-A1 Resin Composition, Polyimide Resin Composition, Polybenzoxazole Resin Composition, Varnish, Resin Film and Semiconductor Device Using the Same SUMITOMO BAKELITE COMPANY LTD. (JP) 2008-10-16 US disclosed
EP-1813637-A1 RESIN COMPOSITION, POLYIMIDE RESIN COMPOSITION, POLY- BENZOXAZOLE RESIN COMPOSITION, VARNISHES, RESIN FILMS AND SEMICONDUCTOR DEVICES MADE BY USING THE SAME Sumitomo Bakelite Company, Limited (JP) 2007-08-01 EP disclosed