SCHEMBL272680

SCHEMBL272680

CC12C=CCCC1(C)C(=O)OC2=O

nearest known ligand 0.31

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TP53 P04637 3/20 0.31
CYP3A4 P08684 3/20 0.31
MAPK1 P28482 3/20 0.31
HIF1A Q16665 2/20 0.31
LMNA P02545 2/20 0.31
CYP1A2 P05177 2/20 0.31
SMN1; SMN2 Q16637 2/20 0.31
NPC1 O15118 2/20 0.31
RAB9A P51151 2/20 0.31
NFKB1 P19838 1/20 0.31
THPO P40225 1/20 0.31
PPM1B O75688 1/20 0.31
PTPN1 P18031 1/20 0.31
PPP1CC P36873 1/20 0.31
TFPI2 P48307 1/20 0.31
PPP5C P53041 1/20 0.31
PPP2CA P67775 1/20 0.31
PPP1CA P62136 1/20 0.31
KDM4E B2RXH2 1/20 0.31
GMNN O75496 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7192941 0.71
SCHEMBL10420275 0.70
SCHEMBL11257650 0.69 TP53 (0.37) TP53CYP3A4MAPK1HIF1ALMNA
SCHEMBL11258471 0.69 LMNA (0.42) TP53CYP3A4MAPK1HIF1ALMNA
SCHEMBL7595679 0.69
SCHEMBL10782642 0.68 TP53 (0.38) TP53CYP3A4MAPK1HIF1ALMNA
SCHEMBL28406380 0.65 TP53 (0.31) TP53CYP3A4MAPK1HIF1ALMNA
SCHEMBL1305216 0.65 TP53 (0.39) TP53CYP3A4MAPK1HIF1ALMNA
SCHEMBL28821693 0.65 TP53 (0.34) TP53CYP3A4MAPK1HIF1ALMNA
SCHEMBL11759434 0.64 TP53 (0.42) TP53CYP3A4MAPK1HIF1ALMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 844 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-109880298-A A kind of high insulating epoxy composite material of high thermal conductivity and its preparation and application 清华大学 2019-06-14 CN claimed
CN-109553766-A Modified polyester polyol and preparation method and application thereof 长兴材料工业(广东)有限公司 2019-04-02 CN claimed
US-20160137823-A1 COMPOSITE MATERIAL FOR MEANS OF TRANSPORT INCLUDING POLYPROPYLENE RESIN AND LONG CARBON FIBER KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY (KR) 2016-05-19 US claimed
CN-101800100-B Manufacturing process of medium-voltage solid insulating sleeve GUANGXI YINHE DECOM ELECTRIC 2012-05-23 CN claimed
US-12630707-B2 Resin composition for sealing optical semiconductor, resin molded product for sealing optical semiconductor, optical semiconductor sealing material, and optical semiconductor device NITTO DENKO CORPORATION (JP) 2026-05-19 US disclosed
EP-4718592-A1 EXTERIOR MATERIAL FOR POWER STORAGE DEVICE AND POWER STORAGE DEVICE Toppan Holdings Inc. (JP) 2026-04-01 EP disclosed
US-20260081269-A1 POWER STORAGE DEVICE PACKAGING MATERIAL AND POWER STORAGE DEVICE TOPPAN HOLDINGS INC. (JP) 2026-03-19 US disclosed
US-12562440-B2 Terminal film for power storage device, and power storage device TOPPAN INC. (JP) 2026-02-24 US disclosed
US-12552888-B2 Curable resin composition and display device SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2026-02-17 US disclosed
EP-4685217-A1 AQUEOUS LUBRICANT COMPOSITION Mitsui Chemicals, Inc. (JP) 2026-01-28 EP disclosed
US-12528983-B2 Curable resin composition and display device SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2026-01-20 US disclosed
US-12504564-B2 Layered body and display device SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2025-12-23 US disclosed
US-4908411-A Ethylene, alpha olefin, grafted thereto unsaturated carboxylic acid, styrene hydrocarbon, unsaturated silane compound MITSUI PETROCHEMICAL INDUSTRIES, LTD. (JP) 1990-03-13 US disclosed
EP-0336780-A2 Thermoplastic resin or elastomer composition having excellent paint adhesion and laminate comprising layer of said thermoplastic elastomer and polyurethane layer MITSUI PETROCHEMICAL INDUSTRIES, LTD. (JP) 1989-10-11 EP disclosed
US-4818785-A RUBBER AND PLASTICS MODIFIERS; IMPROVED MOLDABILITY AND ELASTICITY MITSUI PETROCHEMICAL INDUSTRIES, LTD. (JP) 1989-04-04 US disclosed
US-4812513-A GRAFT COPOLYMERIZED OLEFIN COPOLYMER, EPOXY RESIN, HARDENER MITSUI PETROCHEMICAL INDUSTRIES, LTD. (JP) 1989-03-14 US disclosed
EP-0277236-A1 EPOXY RESIN COMPOSITION AND PROCESS FOR PREPARING THE SAME MITSUI PETROCHEMICAL INDUSTRIES, LTD. (JP) 1988-08-10 EP disclosed
EP-0215959-A1 PARTICULATE, CROSSLINKED AMORPHOUS COPOLYMER, PROCESS FOR ITS PRODUCTION, AND USE THEREOF MITSUI PETROCHEMICAL INDUSTRIES, LTD. (JP) 1987-04-01 EP disclosed
EP-0183493-A2 Modified ethylenic random copolymer MITSUI PETROCHEMICAL INDUSTRIES, LTD. (JP) 1986-06-04 EP disclosed
US-4206097-A EPOXY RESIN-POLYAMINOAMIDE ADDUCT, AMINE SCHERING AKTIENGESELLSCHAFT (DE) 1980-06-03 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (5 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260081269-A1 POWER STORAGE DEVICE PACKAGING MATERIAL AND POWER STORAGE DEVICE MLLT3, SMCHD1, SMC4 TP53 2798/4885CYP3A4 4107/4885MAPK1 2447/4885
US-12552888-B2 Curable resin composition and display device RAD51, LPO, FTO TP53 3277/4885CYP3A4 3853/4885MAPK1 3559/4885
US-12562440-B2 Terminal film for power storage device, and power storage device POT1, SCO2, TELO2 TP53 4141/4885CYP3A4 4020/4885MAPK1 2450/4885
US-12528983-B2 Curable resin composition and display device TIPRL, NLRP1, RCSD1 TP53 4399/4885CYP3A4 4331/4885MAPK1 3778/4885
US-12630707-B2 Resin composition for sealing optical semiconductor, resin molded product for sealing optical semiconductor, optical semiconductor sealing material, and optical semiconductor device PSMC6, SEM1, AAAS TP53 3829/4885CYP3A4 2270/4885MAPK1 2461/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.