SCHEMBL27438012

SCHEMBL27438012

Cc1cc(C)cc(OC(=O)c2cc[nH]n2)c1.[Cu]

nearest known ligand 0.47

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ MAPT P10636 5/20 0.44
▸ THRB P10828 1/20 0.44
▸ TP53 P04637 2/20 0.42
▸ KMT2A Q03164 4/20 0.42
▸ MEN1 O00255 2/20 0.42
▸ ALDH1A1 P00352 1/20 0.41
▸ CYP2C9 P11712 2/20 0.36
▸ ALPL P05186 1/20 0.36
▸ CYP3A4 P08684 1/20 0.36
▸ ALPI P09923 1/20 0.36
▸ ALPG P10696 1/20 0.36
▸ CYP2C19 P33261 1/20 0.36
▸ POLB P06746 1/20 0.35
▸ LMNA P02545 2/20 0.34
▸ HPGD P15428 1/20 0.34
▸ CYP1A2 P05177 2/20 0.33
▸ RECQL P46063 2/20 0.33
▸ KDM4C Q9H3R0 1/20 0.33
▸ HSD17B10 Q99714 1/20 0.33
▸ GAA P10253 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10710630 0.77 LMNA (0.51) MAPTTHRBTP53KMT2AALDH1A1
SCHEMBL15300224 0.76 MAPT (0.47) MAPTTP53KMT2AMEN1ALDH1A1
SCHEMBL28024794 0.73 MAPT (0.49) MAPTTHRBTP53KMT2AMEN1
SCHEMBL29111812 0.73 KMT2A (0.46) MAPTKMT2AMEN1ALDH1A1POLB
SCHEMBL28787723 0.72 ALDH1A1 (0.33) ALDH1A1HSD17B10
SCHEMBL877674 0.71 — —
SCHEMBL29004329 0.71 KMT2A (0.61) MAPTTHRBKMT2AMEN1CYP2C9
SCHEMBL28508119 0.71 ALDH1A1 (0.49) MAPTTP53KMT2AALDH1A1LMNA
SCHEMBL561497 0.70 CYP1A2 (0.56) MAPTTHRBTP53KMT2AMEN1
SCHEMBL13384882 0.69 KMT2A (0.68) MAPTTHRBKMT2AMEN1ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-1122119-C Method and appts. for metal layer by electrolytic deposition ATOTECH DEUTSCHLAND GMBH (DE) 2003-09-24 — — CN disclosed
CN-1138638-A Method and appts. for metal layer by electrolytic deposition ATOTECH DEUTSCHLAND GMBH (DE) 1996-12-25 — — CN disclosed
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