SCHEMBL2745841

SCHEMBL2745841

[C]#Cc1ccccc1C12CC3CC(CC(C3)C1(C)C)C2

nearest known ligand 0.35

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
CNR2 P34972 1/20 0.32
HSD11B1 P28845 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2746795 0.79
SCHEMBL2747855 0.76 ALDH1A1 (0.36) CNR2HSD11B1
SCHEMBL11547069 0.74 HSD11B1 (0.41) HSD11B1
SCHEMBL9464211 0.72 HSD11B1 (0.38) CNR2HSD11B1
SCHEMBL6764233 0.69 P2RX7 (0.30)
SCHEMBL2747151 0.65 KDM4E (0.34) CNR2
SCHEMBL6762003 0.63 NPC1 (0.33) HSD11B1
SCHEMBL7047928 0.63
SCHEMBL5475379 0.62 TSHR (0.35)
SCHEMBL6764289 0.60

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8337982-B2 Comprising first repeating unit obtained by reaction of bisaminophenol compound and dicarboxylic acid, at least one of which has diamondoid structure and second repeating unit obtained by reaction of bisaminophenol compound having no diamondoid structure and dicarboxylic acid; heat resistance SUMITOMO BAKELITE CO., LTD. (JP) 2012-12-25 US disclosed
US-8178631-B2 Resin composition, varnish, resin film and semiconductor device SUMITOMO BAKELITE COMPANY, LTD. (JP) 2012-05-15 US disclosed
US-20090214860-A1 Resin Composition, Varnish, Resin Film and Semiconductor Device SUMITOMO BAKELITE COMPANY, LTD. (JP) 2009-08-27 US disclosed
US-20080206548-A1 Benzoxazole Resin Precursor, Polybenzoxazole Resin, Resin Film And Semiconductor Device SUMITOMO BAKELITE CO., LTD (JP) 2008-08-28 US disclosed
EP-1953181-A1 RESIN COMPOSITION, VARNISH, RESIN FILM AND SEMICONDUCTOR DEVICE Sumitomo Bakelite Company, Ltd. (JP) 2008-08-06 EP disclosed
EP-1832619-A1 BENZOXAZOLE RESIN PRECURSOR, POLYBENZOXAZOLE RESIN, RESIN FILM, AND SEMICONDUCTOR DEVICE Sumitomo Bakelite Company, Limited (JP) 2007-09-12 EP disclosed