SCHEMBL2746690

SCHEMBL2746690

Nc1ccc(Oc2cccc(Oc3ccc(N)c(O)c3)c2C#CC2C3CC4CC(C3)CC2C4)cc1O

nearest known ligand 0.34

Predicted protein targets (top 7)

geneUniProtsupporting neighboursconfidence
MMP2 P08253 1/20 0.34
MMP14 P50281 1/20 0.34
GAA P10253 1/20 0.31
RCE1 Q9Y256 1/20 0.31
F10 P00742 1/20 0.31
NCOA1 Q15788 1/20 0.30
NCOA3 Q9Y6Q9 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2747389 0.82 GAA (0.30) GAARCE1
SCHEMBL2747208 0.81 KDM4E (0.34) GAA
SCHEMBL2709017 0.71 GAA (0.36) MMP2MMP14GAARCE1F10
SCHEMBL2709273 0.71 MMP2 (0.36) MMP2MMP14
SCHEMBL2708206 0.71 MMP2 (0.34) MMP2MMP14
SCHEMBL716943 0.70 GAA (0.52) MMP2MMP14GAARCE1F10
SCHEMBL28336683 0.70 NCOA1 (0.61) MMP2MMP14GAARCE1NCOA1
SCHEMBL2746920 0.70 ALOX15 (0.41) MMP2MMP14GAARCE1F10
SCHEMBL4849002 0.69 GAA (0.47) MMP2MMP14GAARCE1F10
SCHEMBL2746860 0.67 GAA (0.31) MMP2MMP14GAA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8337982-B2 Comprising first repeating unit obtained by reaction of bisaminophenol compound and dicarboxylic acid, at least one of which has diamondoid structure and second repeating unit obtained by reaction of bisaminophenol compound having no diamondoid structure and dicarboxylic acid; heat resistance SUMITOMO BAKELITE CO., LTD. (JP) 2012-12-25 US disclosed
US-8178631-B2 Resin composition, varnish, resin film and semiconductor device SUMITOMO BAKELITE COMPANY, LTD. (JP) 2012-05-15 US disclosed
US-20090214860-A1 Resin Composition, Varnish, Resin Film and Semiconductor Device SUMITOMO BAKELITE COMPANY, LTD. (JP) 2009-08-27 US disclosed
US-20080206548-A1 Benzoxazole Resin Precursor, Polybenzoxazole Resin, Resin Film And Semiconductor Device SUMITOMO BAKELITE CO., LTD (JP) 2008-08-28 US disclosed
EP-1953181-A1 RESIN COMPOSITION, VARNISH, RESIN FILM AND SEMICONDUCTOR DEVICE Sumitomo Bakelite Company, Ltd. (JP) 2008-08-06 EP disclosed
EP-1832619-A1 BENZOXAZOLE RESIN PRECURSOR, POLYBENZOXAZOLE RESIN, RESIN FILM, AND SEMICONDUCTOR DEVICE Sumitomo Bakelite Company, Limited (JP) 2007-09-12 EP disclosed