SCHEMBL2747002

SCHEMBL2747002

CCC(c1ccccc1C#CC(=O)O)c1ccccc1C#CC(=O)O

nearest known ligand 0.39

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CYSLTR2 Q9NS75 1/20 0.39
CYSLTR1 Q9Y271 1/20 0.39
HSP90AA1 P07900 1/20 0.37
NTSR1 P30989 1/20 0.37
FFAR1 O14842 3/20 0.36
TSHR P16473 1/20 0.35
MMP2 P08253 1/20 0.35
MMP9 P14780 1/20 0.35
MMP12 P39900 1/20 0.35
MMP14 P50281 1/20 0.35
MMP15 P51511 1/20 0.35
MMP16 P51512 1/20 0.35
MMP26 Q9NRE1 1/20 0.35
L3MBTL1 Q9Y468 2/20 0.34
POLB P06746 2/20 0.34
GPR84 Q9NQS5 1/20 0.34
HTT P42858 1/20 0.34
NPSR1 Q6W5P4 1/20 0.34
CYP3A4 P08684 1/20 0.34
CYP2C9 P11712 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5047626 0.80 NPC1 (0.42) CYSLTR2CYSLTR1FFAR1POLBSMN1; SMN2
SCHEMBL28097871 0.80 FFAR1 (0.37) CYSLTR2CYSLTR1HSP90AA1NTSR1FFAR1
SCHEMBL30772315 0.77 HSP90AA1 (0.48) HSP90AA1NTSR1FFAR1TSHRL3MBTL1
SCHEMBL5814653 0.77 FFAR1 (0.53) HSP90AA1NTSR1FFAR1L3MBTL1NPSR1
SCHEMBL12469659 0.75 L3MBTL1 (0.53) TSHRL3MBTL1POLBNPSR1CYP2C19
SCHEMBL30231559 0.72 FFAR1 (0.49) HSP90AA1NTSR1FFAR1TSHRNPSR1
SCHEMBL670980 0.72 FFAR1 (0.49) HSP90AA1NTSR1FFAR1TSHRNPSR1
SCHEMBL5629534 0.70 MGLL (0.37) FFAR1
SCHEMBL2745845 0.70 NPC1 (0.43) FFAR1MMP2MMP9MMP12MMP14
SCHEMBL3468255 0.68 PTGDR2 (0.51) HSP90AA1NTSR1FFAR1TSHRPOLB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8337982-B2 Comprising first repeating unit obtained by reaction of bisaminophenol compound and dicarboxylic acid, at least one of which has diamondoid structure and second repeating unit obtained by reaction of bisaminophenol compound having no diamondoid structure and dicarboxylic acid; heat resistance SUMITOMO BAKELITE CO., LTD. (JP) 2012-12-25 US disclosed
US-8178631-B2 Resin composition, varnish, resin film and semiconductor device SUMITOMO BAKELITE COMPANY, LTD. (JP) 2012-05-15 US disclosed
US-7608928-B2 Laminated body and semiconductor device JSR CORPORATION (JP) 2009-10-27 US disclosed
US-20090214860-A1 Resin Composition, Varnish, Resin Film and Semiconductor Device SUMITOMO BAKELITE COMPANY, LTD. (JP) 2009-08-27 US disclosed
US-20080206548-A1 Benzoxazole Resin Precursor, Polybenzoxazole Resin, Resin Film And Semiconductor Device SUMITOMO BAKELITE CO., LTD (JP) 2008-08-28 US disclosed
EP-1953181-A1 RESIN COMPOSITION, VARNISH, RESIN FILM AND SEMICONDUCTOR DEVICE Sumitomo Bakelite Company, Ltd. (JP) 2008-08-06 EP disclosed
US-20080044664-A1 Laminated Body and Semiconductor Drive JSR CORPORATION (JP) 2008-02-21 US disclosed
EP-1832619-A1 BENZOXAZOLE RESIN PRECURSOR, POLYBENZOXAZOLE RESIN, RESIN FILM, AND SEMICONDUCTOR DEVICE Sumitomo Bakelite Company, Limited (JP) 2007-09-12 EP disclosed
EP-1760774-A1 LAMINATED BODY AND SEMICONDUCTOR DEVICE JSR Corporation (JP) 2007-03-07 EP disclosed