SCHEMBL2747516

SCHEMBL2747516

C#Cc1c(C23CC4CC(CC(C4)C2)C3)ccc2c1C(c1ccc(Oc3ccc(N)c(O)c3)cc1)(c1ccc(Oc3ccc(N)c(O)c3)cc1)c1cc(C34CC5CC(CC(C5)C3)C4)ccc1-2

nearest known ligand 0.34

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
MEN1 O00255 3/20 0.34
KMT2A Q03164 3/20 0.34
POLB P06746 1/20 0.34
GAA P10253 1/20 0.34
GFER P55789 1/20 0.34
PDE4D Q08499 10/20 0.34
CNR2 P34972 2/20 0.33
ALDH1A1 P00352 1/20 0.31
LMNA P02545 1/20 0.31
L3MBTL1 Q9Y468 1/20 0.31
MMP2 P08253 1/20 0.31
MMP14 P50281 1/20 0.31
RAB9A P51151 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2747752 0.86 MEN1 (0.41) MEN1KMT2APOLBGAAGFER
SCHEMBL2707241 0.86 MEN1 (0.44) MEN1KMT2APOLBGAAGFER
SCHEMBL5086572 0.76 MEN1 (0.50) MEN1KMT2APOLBGAAGFER
SCHEMBL2707238 0.76 MEN1 (0.40) MEN1KMT2APOLBGAAGFER
SCHEMBL2710478 0.75 MEN1 (0.42) MEN1KMT2APOLBGAAGFER
SCHEMBL2709287 0.75 PDE4D (0.36) MEN1KMT2AGAAPDE4DALDH1A1
SCHEMBL2706770 0.73 ALDH1A1 (0.54) MEN1KMT2APOLBGAAGFER
SCHEMBL2710472 0.72 PDE4D (0.36) MEN1KMT2AGAAPDE4DALDH1A1
SCHEMBL2747518 0.72 MMP2 (0.34) MEN1KMT2APDE4DALDH1A1LMNA
SCHEMBL2709265 0.71 KMT2A (0.48) MEN1KMT2APOLBGAAGFER

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8337982-B2 Comprising first repeating unit obtained by reaction of bisaminophenol compound and dicarboxylic acid, at least one of which has diamondoid structure and second repeating unit obtained by reaction of bisaminophenol compound having no diamondoid structure and dicarboxylic acid; heat resistance SUMITOMO BAKELITE CO., LTD. (JP) 2012-12-25 US disclosed
US-8178631-B2 Resin composition, varnish, resin film and semiconductor device SUMITOMO BAKELITE COMPANY, LTD. (JP) 2012-05-15 US disclosed
US-20090214860-A1 Resin Composition, Varnish, Resin Film and Semiconductor Device SUMITOMO BAKELITE COMPANY, LTD. (JP) 2009-08-27 US disclosed
US-20080206548-A1 Benzoxazole Resin Precursor, Polybenzoxazole Resin, Resin Film And Semiconductor Device SUMITOMO BAKELITE CO., LTD (JP) 2008-08-28 US disclosed
EP-1953181-A1 RESIN COMPOSITION, VARNISH, RESIN FILM AND SEMICONDUCTOR DEVICE Sumitomo Bakelite Company, Ltd. (JP) 2008-08-06 EP disclosed