SCHEMBL276842

SCHEMBL276842

CCC(C)(CC)C(N)=O

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Propionamide SCHEMBL17925395 0.92 MAPT (0.33)
SCHEMBL16938896 0.86
SCHEMBL5955337 0.86
SCHEMBL30375370 0.84 LMNA (0.34)
SCHEMBL22326592 0.84 CYP2D6 (0.33)
SCHEMBL7763609 0.84 LMNA (0.43)
SCHEMBL3000508 0.82 TSHR (0.35)
Acrylic Acid SCHEMBL11668481 0.82 LMNA (0.42)
SCHEMBL14457219 0.80
SCHEMBL27413817 0.80 MMP8 (0.35)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 885 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20260015461-A1 POLYIMIDE PRECURSOR PI ADVANCED MAT CO LTD (KR) 2026-01-15 US claimed
US-20260001995-A1 POLYIMIDE PRECURSOR PI ADVANCED MAT CO LTD (KR) 2026-01-01 US claimed
EP-3578590-B1 POLYIMIDE PRECURSOR SOLUTION AND POLYIMIDE FILM PRODUCED USING SAME LG CHEMICAL LTD (KR) 2025-11-05 EP claimed
EP-4626991-A1 POLYIMIDE VARNISH FOR COATING CONDUCTOR WITH IMPROVED HEAT DISSIPATION FOR COATING CONDUCTOR AND POLYIMIDE COATING MATERIAL COMPRISING THE SAME PI Advanced Materials Co., Ltd. (KR) 2025-10-08 EP claimed
CN-120167004-A Polyimide varnish for coated conductor with improved heat dissipation to coated conductor and polyimide coating material containing same 聚酰亚胺先端材料有限公司 2025-06-17 CN claimed
EP-4509547-A1 POLYIMIDE PRECURSOR PI Advanced Materials Co., Ltd. (KR) 2025-02-19 EP claimed
EP-4509548-A1 POLYIMIDE PRECURSOR PI Advanced Materials Co., Ltd. (KR) 2025-02-19 EP claimed
CN-119072517-A Polyimide precursor PI尖端素材株式会社 2024-12-03 CN claimed
CN-119013331-A Polyimide precursor PI尖端素材株式会社 2024-11-22 CN claimed
EP-3536732-B1 POLYIMIDE PRECURSOR COMPOSITION AND POLYIMIDE FILM USING SAME LG CHEMICAL LTD (KR) 2024-11-06 EP claimed
EP-1329487-A1 Aqueous ink-jet inks for printing on commercial offset coated media Hewlett-Packard Company (US) 2003-07-23 EP claimed
CN-1422268-A 5-alkylpyrido [2,3-D] pyrimidines tyrosine kinase inhibitors WARNER LAMBERT CO (US) 2003-06-04 CN claimed
EP-1242366-A1 SALICYLAMIDES AS SERINE PROTEASE AND FACTOR XA INHIBITORS AXYS PHARMACEUTICALS, INC. (US) 2002-09-25 EP claimed
US-20020052343-A1 Salicylamides as serine protease inhibitors AXYS PHARMACEUTICALS, INC. 2002-05-02 US claimed
WO-2001044172-A1 SALICYLAMIDES AS SERINE PROTEASE AND FACTOR XA INHIBITORS AXYS PHARMACEUTICALS, INC. (US) 2001-06-21 WO claimed
US-5245004-A ANHYDROUS POLYMERIZATION OF CAPROLACTAM WITH CATALYST, COCATALYST AND ACTIVATOR UNITIKA LTD. (JP) 1993-09-14 US claimed
EP-0522533-A1 Process for polymerizing epsilon-caprolactam UNITIKA LTD. (JP) 1993-01-13 EP claimed
US-4866177-A Process for one-step synthesis of amides TEXACO INC. (US) 1989-09-12 US claimed
US-4854973-A SHORT CHAIN CHLORINATED SOLVENTS NCH CORPORATION (US) 1989-08-08 US claimed
US-4013715-A PROCESS FOR THE MANUFACTURE OF 2-HALO-ETHANE-PHOSPHONIC ACID DIHALIDES AND VINYL-PHOSPHONIC ACID DIHALIDES HOECHST AKTIENGESELLSCHAFT (DT) 1977-03-22 US claimed