SCHEMBL27714656

SCHEMBL27714656

Cc1cc(COc2cccc(O)c2C)ccc1O

nearest known ligand 0.49

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MAPT P10636 2/20 0.49
L3MBTL1 Q9Y468 2/20 0.49
MAPK1 P28482 1/20 0.49
TDP1 Q9NUW8 1/20 0.49
ESR1 P03372 1/20 0.49
ESR2 Q92731 1/20 0.49
LMNA P02545 1/20 0.46
RAB9A P51151 1/20 0.46
APP P05067 1/20 0.44
MRGPRX4 Q96LA9 3/20 0.44
MAOB P27338 2/20 0.44
RXRA P19793 4/20 0.43
FFAR4 Q5NUL3 4/20 0.42
RXRB P28702 3/20 0.41
FFAR1 O14842 2/20 0.40
RXRG P48443 2/20 0.40
TRPA1 O75762 1/20 0.40
ATM Q13315 1/20 0.40
HSD17B1 P14061 1/20 0.39
HSD17B2 P37059 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5674481 0.80 MAPT (0.76) MAPTL3MBTL1MAPK1TDP1APP
SCHEMBL7909614 0.77 ABCB1 (0.53) MAPTL3MBTL1MAPK1TDP1MAOB
SCHEMBL7510928 0.76 MAPT (0.46) MAPTL3MBTL1MAPK1TDP1LMNA
SCHEMBL4616640 0.74 APP (0.54) MAPTL3MBTL1MAPK1TDP1LMNA
SCHEMBL20630462 0.73 L3MBTL1 (0.50) MAPTL3MBTL1MAPK1TDP1LMNA
SCHEMBL5173662 0.72 CA1 (0.47) MAPTL3MBTL1MAPK1TDP1LMNA
SCHEMBL30562870 0.72 CA1 (0.47) MAPTL3MBTL1MAPK1TDP1LMNA
SCHEMBL3015906 0.72 ESR1 (0.63) MAPTMAPK1TDP1ESR1ESR2
SCHEMBL20630447 0.72 L3MBTL1 (0.49) MAPTL3MBTL1MAPK1TDP1LMNA
SCHEMBL8897512 0.71 MAPT (0.47) MAPTL3MBTL1MAPK1TDP1LMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-101278239-B Process for producing substrate with metal wiring NIPPON ZEON CO 2011-11-16 CN disclosed
CN-101278239-A Process for producing substrate with metal wiring ZEON CORP (JP) 2008-10-01 CN disclosed