SCHEMBL2804376

SCHEMBL2804376

CCO[SiH](OCC)OCCCCl

nearest known ligand 0.35

Predicted protein targets (top 5)

geneUniProtsupporting neighboursconfidence
TSHR P16473 2/20 0.35
TDP1 Q9NUW8 1/20 0.35
ALDH1A1 P00352 1/20 0.32
CA1 P00915 1/20 0.30
CA2 P00918 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5275105 0.93 TSHR (0.36) TSHRTDP1ALDH1A1
SCHEMBL931736 0.79 ADRB2 (0.39) TSHRALDH1A1CA1CA2
SCHEMBL5346538 0.79 ADRB2 (0.39) TSHRALDH1A1CA1CA2
SCHEMBL28312490 0.78 TSHR (0.35) TSHRTDP1ALDH1A1
SCHEMBL28311535 0.78 TSHR (0.62) TSHRTDP1ALDH1A1
SCHEMBL1608608 0.77 THRB (0.35) TSHRTDP1ALDH1A1CA1CA2
SCHEMBL3321056 0.77 THRB (0.35) TSHRTDP1ALDH1A1CA1CA2
SCHEMBL28306304 0.76 SMN1; SMN2 (0.36) TSHRTDP1ALDH1A1
SCHEMBL11271585 0.76 ALDH1A1 (0.31) TSHRALDH1A1
SCHEMBL7997930 0.75 TSHR (0.41) TSHRTDP1ALDH1A1CA1CA2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 121 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-114055975-A Ink jet recording method and ink jet recording apparatus 精工爱普生株式会社 2022-02-18 CN disclosed
US-20220032618-A1 Ink Jet Printing Method And Ink Jet Printing Apparatus SEIKO EPSON CORPORATION (JP) 2022-02-03 US disclosed
EP-3067395-B1 ULTRAVIOLET RADIATION-CURABLE COMPOSITION, AND RECORDED MATTER SEIKO EPSON CORP (JP) 2020-10-28 EP disclosed
US-10759119-B2 Three dimensional mold object manufacturing apparatus, method for manufacturing three dimensional mold object, and three dimensional mold object SEIKO EPSON CORPORATION (JP) 2020-09-01 US disclosed
US-10392522-B2 Ultraviolet curable composition and recorded object SEIKO EPSON CORPORATION (JP) 2019-08-27 US disclosed
US-10279603-B2 Production method of recording material, and recording material SEIKO EPSON CORPORATION (JP) 2019-05-07 US disclosed
US-10259208-B2 Three-dimensional shaped object manufacturing device, method for manufacturing three-dimensional shaped object, and three-dimensional shaped object SEIKO EPSON CORPORATION (JP) 2019-04-16 US disclosed
US-20190054704-A1 THREE DIMENSIONAL MOLD OBJECT MANUFACTURING APPARATUS, METHOD FOR MANUFACTURING THREE DIMENSIONAL MOLD OBJECT, AND THREE DIMENSIONAL MOLD OBJECT SEIKO EPSON CORPORATION (JP) 2019-02-21 US disclosed
US-10137637-B2 Three dimensional mold object manufacturing apparatus, method for manufacturing three dimensional mold object, and three dimensional mold object SEIKO EPSON CORPORATION (JP) 2018-11-27 US disclosed
US-10053590-B2 Composition for inkjet and recording material SEIKO EPSON CORPORATION (JP) 2018-08-21 US disclosed
EP-2168757-A1 METHOD FOR PRODUCING PLASTIC LENS Hoya Corporation (JP) 2010-03-31 EP disclosed
US-20090077798-A1 METHOD FOR FORMING CONDUCTIVE POST, METHOD FOR MANUFACTURING MULTILAYERED WIRING SUBSTRATE, AND METHOD FOR MANUFACTURING ELECTRONIC APPARATUS SEIKO EPSON CORPORATION (JP) 2009-03-26 US disclosed
CN-101394714-A Method for producing multilayered wiring substrate, multilayered wiring substrate, and electronic apparatus SEIKO EPSON CORP (JP) 2009-03-25 CN disclosed
US-20090071706-A1 METHOD FOR PRODUCING MULTILAYERED WIRING SUBSTRATE, MULTILAYERED WIRING SUBSTRATE, AND ELECTRONIC APPARATUS SEIKO EPSON CORPORATION (JP) 2009-03-19 US disclosed
US-7500895-B2 Patterned substrate, electro-optical device, and method for manufacturing an electro-optical device SEIKO EPSON CORPORATION (JP) 2009-03-10 US disclosed
US-20080317943-A1 METHOD FOR FORMING PATTERN, METHOD FOR MANUFACTURING ELECTRO-OPTICAL DEVICE, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE SEIKO EPSON CORPORATION (JP) 2008-12-25 US disclosed
US-20080311285-A1 CONTACT HOLE FORMING METHOD, CONDUCTING POST FORMING METHOD, WIRING PATTERN FORMING METHOD, MULTILAYERED WIRING SUBSTRATE PRODUCING METHOD, ELECTRO-OPTICAL DEVICE PRODUCING METHOD, AND ELECTRONIC APPARATUS PRODUCING METHOD SEIKO EPSON CORPORATION (JP) 2008-12-18 US disclosed
US-20060127563-A1 Patterned substrate, electro-optical device, and method for manufacturing an electro-optical device SEIKO EPSON CORPORATION (JP) 2006-06-15 US disclosed
US-20060019034-A1 Process for producing chemical adsorption film and chemical adsorption film SEIKO EPSON CORPORATION (JP) 2006-01-26 US disclosed
US-20050287392-A1 Organic electroluminescent device, method for producing the same, and electronic apparatus SEIKO EPSON CORPORATION (JP) 2005-12-29 US disclosed