SCHEMBL28053371

SCHEMBL28053371

NN1CN=CN(c2ccccc2)C1

nearest known ligand 0.36

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
NPC1 O15118 3/20 0.36
RAB9A P51151 3/20 0.36
HPGD P15428 1/20 0.36
SMN1; SMN2 Q16637 1/20 0.36
MAPT P10636 3/20 0.34
KDM4E B2RXH2 2/20 0.34
GLA P06280 1/20 0.34
MAPK1 P28482 1/20 0.34
TDP1 Q9NUW8 1/20 0.34
L3MBTL1 Q9Y468 1/20 0.34
SIGMAR1 Q99720 2/20 0.32
CYP3A4 P08684 1/20 0.31
MAOB P27338 2/20 0.30
MEN1 O00255 1/20 0.30
ALDH1A1 P00352 1/20 0.30
STAT1 P42224 1/20 0.30
KMT2A Q03164 1/20 0.30
MAOA P21397 1/20 0.30
NOTUM Q6P988 1/20 0.30
NPSR1 Q6W5P4 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL574986 0.78 NPSR1 (0.38) NPC1RAB9AHPGDSMN1; SMN2MAPT
SCHEMBL9154800 0.77 SMN1; SMN2 (0.36) NPC1RAB9AHPGDSMN1; SMN2MAPT
SCHEMBL6272216 0.67 SIGMAR1 (0.41) NPC1RAB9AHPGDSMN1; SMN2MAPT
SCHEMBL105023 0.67 SIGMAR1 (0.41) NPC1RAB9AHPGDSMN1; SMN2MAPT
SCHEMBL3861449 0.65 MAPT (0.41) NPC1RAB9AHPGDSMN1; SMN2MAPT
Hydrochloric Acid SCHEMBL27446824 0.65 NPC1 (0.43) NPC1RAB9AHPGDSMN1; SMN2MAPT
SCHEMBL6153529 0.65
SCHEMBL21864339 0.64 SMN1; SMN2 (0.38) NPC1RAB9AHPGDSMN1; SMN2MAPT
SCHEMBL10506381 0.64 SIGMAR1 (0.38) NPC1RAB9AHPGDSMN1; SMN2MAPT
SCHEMBL6369470 0.64 HPGD (0.38) NPC1RAB9AHPGDSMN1; SMN2MAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-105238314-A Dampness-heat-resistant high-reliability epoxy conductive silver adhesive as well as preparation method and application thereof SHENZHEN INST OF ADV TECH CAS 2016-01-13 CN claimed
CN-105238314-B A kind of wet-heat resisting high reliability epoxy conductive silver glue and preparation method and application 深圳先进技术研究院 2017-11-07 CN disclosed
CN-105238314-A Dampness-heat-resistant high-reliability epoxy conductive silver adhesive as well as preparation method and application thereof SHENZHEN INST OF ADV TECH CAS 2016-01-13 CN disclosed