SCHEMBL2806244

SCHEMBL2806244

CCO[Si](CCc1ccccc1)(OCC)OCCCC#N

nearest known ligand 0.36

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
NAAA Q02083 1/20 0.35
SMN1; SMN2 Q16637 2/20 0.35
RAB9A P51151 1/20 0.35
CTSS P25774 1/20 0.34
CTSK P43235 1/20 0.34
MAOA P21397 2/20 0.34
MAOB P27338 2/20 0.34
EBP Q15125 2/20 0.34
SIGMAR1 Q99720 2/20 0.34
MEN1 O00255 2/20 0.33
KMT2A Q03164 2/20 0.33
ALDH1A1 P00352 1/20 0.33
LTB4R Q15722 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL107467 0.82 TDP1 (0.43) SMN1; SMN2RAB9AALDH1A1
SCHEMBL27646102 0.81 RAB9A (0.37) SMN1; SMN2RAB9AMEN1KMT2A
SCHEMBL27791372 0.81 ALDH1A1 (0.41) SMN1; SMN2RAB9ASIGMAR1MEN1KMT2A
SCHEMBL28065352 0.81 RAB9A (0.38) SMN1; SMN2RAB9ASIGMAR1MEN1KMT2A
SCHEMBL28531764 0.80 MAOA (0.47) SMN1; SMN2RAB9AMAOASIGMAR1
SCHEMBL16766599 0.78 ALDH1A1 (0.36) NAAASMN1; SMN2MAOAMAOBMEN1
SCHEMBL1972960 0.78 LMNA (0.39) SMN1; SMN2RAB9AMEN1KMT2AALDH1A1
SCHEMBL13837050 0.78 ANPEP (0.33) SMN1; SMN2CTSSCTSKMAOAMAOB
SCHEMBL28797034 0.76 SMN1; SMN2 (0.35) SMN1; SMN2RAB9ASIGMAR1MEN1KMT2A
SCHEMBL27769950 0.76 SMN1; SMN2 (0.35) SMN1; SMN2RAB9ASIGMAR1MEN1KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 75 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-114055975-B Ink jet recording method and ink jet recording apparatus 精工爱普生株式会社 2023-05-12 CN disclosed
CN-114055975-A Ink jet recording method and ink jet recording apparatus 精工爱普生株式会社 2022-02-18 CN disclosed
US-10392522-B2 Ultraviolet curable composition and recorded object SEIKO EPSON CORPORATION (JP) 2019-08-27 US disclosed
US-10300708-B2 Ink jet composition, housing, and ink jet method SEIKO EPSON CORPORATION (JP) 2019-05-28 US disclosed
US-10279603-B2 Production method of recording material, and recording material SEIKO EPSON CORPORATION (JP) 2019-05-07 US disclosed
US-10259208-B2 Three-dimensional shaped object manufacturing device, method for manufacturing three-dimensional shaped object, and three-dimensional shaped object SEIKO EPSON CORPORATION (JP) 2019-04-16 US disclosed
US-10053590-B2 Composition for inkjet and recording material SEIKO EPSON CORPORATION (JP) 2018-08-21 US disclosed
US-9950507-B2 Three-dimensional structure manufacturing apparatus, manufacturing method of three-dimensional structure, and three-dimensional structure SEIKO EPSON CORPORATION (JP) 2018-04-24 US disclosed
US-9920210-B2 Material including layer produced by ultraviolet-curable composition SEIKO EPSON CORPORATION (JP) 2018-03-20 US disclosed
US-9630339-B2 Manufacturing method of three-dimensional structure and three-dimensional structure SEIKO EPSON CORPORATION (JP) 2017-04-25 US disclosed
US-20100239776-A1 METHOD FOR PRODUCING PLASTIC LENS HOYA CORPORATION (JP) 2010-09-23 US disclosed
US-7776397-B2 Process for producing chemical adsorption film and chemical adsorption film SEIKO EPSON CORPORATION (JP) 2010-08-17 US disclosed
EP-2168757-A1 METHOD FOR PRODUCING PLASTIC LENS Hoya Corporation (JP) 2010-03-31 EP disclosed
US-20090077798-A1 METHOD FOR FORMING CONDUCTIVE POST, METHOD FOR MANUFACTURING MULTILAYERED WIRING SUBSTRATE, AND METHOD FOR MANUFACTURING ELECTRONIC APPARATUS SEIKO EPSON CORPORATION (JP) 2009-03-26 US disclosed
US-20090071706-A1 METHOD FOR PRODUCING MULTILAYERED WIRING SUBSTRATE, MULTILAYERED WIRING SUBSTRATE, AND ELECTRONIC APPARATUS SEIKO EPSON CORPORATION (JP) 2009-03-19 US disclosed
US-7500895-B2 Patterned substrate, electro-optical device, and method for manufacturing an electro-optical device SEIKO EPSON CORPORATION (JP) 2009-03-10 US disclosed
US-20080317943-A1 METHOD FOR FORMING PATTERN, METHOD FOR MANUFACTURING ELECTRO-OPTICAL DEVICE, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE SEIKO EPSON CORPORATION (JP) 2008-12-25 US disclosed
US-20080311285-A1 CONTACT HOLE FORMING METHOD, CONDUCTING POST FORMING METHOD, WIRING PATTERN FORMING METHOD, MULTILAYERED WIRING SUBSTRATE PRODUCING METHOD, ELECTRO-OPTICAL DEVICE PRODUCING METHOD, AND ELECTRONIC APPARATUS PRODUCING METHOD SEIKO EPSON CORPORATION (JP) 2008-12-18 US disclosed
US-20060127563-A1 Patterned substrate, electro-optical device, and method for manufacturing an electro-optical device SEIKO EPSON CORPORATION (JP) 2006-06-15 US disclosed
US-20060019034-A1 Process for producing chemical adsorption film and chemical adsorption film SEIKO EPSON CORPORATION (JP) 2006-01-26 US disclosed