SCHEMBL29413071

SCHEMBL29413071

Nc1c(CC2CO2)cc(O)c(CC2CO2)c1CC1CO1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL93389 1.00
Questiomycin B SCHEMBL8595450 0.89 ALOX15 (0.41)
SCHEMBL140952 0.86
SCHEMBL29552434 0.86
SCHEMBL151729 0.86
SCHEMBL28087600 0.86
SCHEMBL703870 0.84 TYR (0.31)
Ethane SCHEMBL29193627 0.81 SHBG (0.30)
SCHEMBL28317496 0.79 MGLL (0.32)
SCHEMBL31097883 0.79

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 45 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4453060-B1 PROCESS FOR PREPARING A RESHAPABLE THERMOSET RESIN MATERIAL SYENSQO SA (BE) 2026-02-11 EP claimed
WO-2025261826-A1 FILTER CARTRIDGE, FILTER MODULE AND METHOD FOR PRODUCING A GAS FILTER MEMBRANE EVONIK OPERATIONS GMBH (DE) 2025-12-26 WO claimed
US-20250066534-A1 PROCESS FOR PREPARING A RESHAPABLE THERMOSET RESIN MATERIAL SYENSQO SA (BE) 2025-02-27 US claimed
EP-4453060-A1 PROCESS FOR PREPARING A RESHAPABLE THERMOSET RESIN MATERIAL SYENSQO SA (BE) 2024-10-30 EP claimed
WO-2023117933-A1 PROCESS FOR PREPARING A RESHAPABLE THERMOSET RESIN MATERIAL SOLVAY SA (BE) 2023-06-29 WO claimed
EP-4142921-A1 THIN-FILM COMPOSITE MEMBRANES SYNTHESIZED BY MULTI-STEP COATING METHODS Katholieke Universiteit Leuven, KU Leuven R&D (BE) 2023-03-08 EP claimed
CN-122011675-A High-temperature-resistant epoxy resin packaging material and preparation method thereof 国鲸合创(青岛)科技有限公司 2026-05-12 CN disclosed
EP-4453060-B1 PROCESS FOR PREPARING A RESHAPABLE THERMOSET RESIN MATERIAL SYENSQO SA (BE) 2026-02-11 EP disclosed
WO-2025151708-A1 COATING COMPOSITIONS COMPRISING A STYRENE MALEIMIDE COPOLYMER PRC-DESOTO INTERNATIONAL, INC. (US) 2025-07-17 WO disclosed
WO-2025132804-A1 PROCESS FOR PREPARING CARBON MONOXIDE (CO) AND MOLECULAR HYDROGEN (H2) BASF SE (DE) 2025-06-26 WO disclosed
US-20250122355-A1 METHOD OF TREATMENT OF A FIBER-REINFORCED COMPOSITE SYENSQO SA (BE) 2025-04-17 US disclosed
CN-119775854-A Protective agent and preparation method thereof 中国地质大学(北京) 2025-04-08 CN disclosed
CN-119638956-A Cured composition, cured product and application thereof 达兴材料股份有限公司 2025-03-18 CN disclosed
WO-2022202563-A1 ELECTRICALLY CONDUCTIVE PASTE, SOLAR CELL ELECTRODE, AND SOLAR CELL ナミックス株式会社 2022-09-29 WO disclosed
WO-2022204686-A1 COATING COMPOSITIONS PPG INDUSTRIES OHIO, INC. (US) 2022-09-29 WO disclosed
EP-3476911-B1 COMPOSITION AND STRUCTURE OF A CROSS-LINKABLE MULTI-PHASE ADHESIVE PROTECHNIC (FR) 2022-09-07 EP disclosed
WO-2022146731-A1 RAPID-CURING RESIN COMPOSITION AND COMPOSITE MATERIAL CONTAINING THE SAME CYTEC INDUSTRIES INC. (US) 2022-07-07 WO disclosed
EP-4003711-A1 FABRIC CONTAINING UNIDIRECTIONAL REINFORCEMENT FIBRE LM Wind Power A/S (DK) 2022-06-01 EP disclosed
US-11319435-B2 Heat-curable resin composition, prepreg, and fiber-reinforced composite material TORAY INDUSTRIES, INC. (JP) 2022-05-03 US disclosed
EP-3962731-A1 BILAYER REINFORCEMENT STRUCTURES Zephyros, Inc. (US) 2022-03-09 EP disclosed