SCHEMBL4496349

SCHEMBL4496349

C1CC(CN(CC2CO2)CC2CO2)CC(CN(CC2CO2)CC2CO2)C1.Nc1c(CC2CO2)c(O)cc(CC2CO2)c1CC1CO1

nearest known ligand 0.31

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
OPRM1 P35372 2/20 0.31
OPRD1 P41143 2/20 0.31
OPRK1 P41145 2/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5495550 0.92 OPRM1 (0.36) OPRM1OPRD1OPRK1
SCHEMBL4496345 0.85 OPRM1 (0.32) OPRM1OPRD1OPRK1
SCHEMBL29552434 0.82
SCHEMBL28087600 0.82
SCHEMBL151729 0.82
SCHEMBL5495546 0.76 OPRM1 (0.36) OPRM1OPRD1OPRK1
SCHEMBL24288 0.73 OPRM1 (0.32) OPRM1OPRD1OPRK1
SCHEMBL31410770 0.73 OPRM1 (0.32) OPRM1OPRD1OPRK1
SCHEMBL93389 0.71
SCHEMBL29413071 0.71

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7501087-B2 Injection molding thermosetting resin composition into reinforcing fiber substrate TORAY INDUSTRIES, INC. (JP) 2009-03-10 US disclosed
US-20070104937-A1 Epoxy resin composition, process for producing fiber-reinforced composite materials and fiber-reinforced composite materials TORAY INDUSTRIES, INC. (JP) 2007-05-10 US disclosed