Predicted protein targets (top 10)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | F2 | P00734 | 1/20 | 0.45 |
| ▸ | HTT | P42858 | 1/20 | 0.39 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.39 |
| ▸ | SMN1; SMN2 | Q16637 | 4/20 | 0.36 |
| ▸ | NPC1 | O15118 | 2/20 | 0.36 |
| ▸ | RAB9A | P51151 | 2/20 | 0.36 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.33 |
| ▸ | POLB | P06746 | 1/20 | 0.31 |
| ▸ | TSHR | P16473 | 1/20 | 0.31 |
| ▸ | NPSR1 | Q6W5P4 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1809562 | 0.86 | F2 (0.39) | F2HTTHSD17B10SMN1; SMN2NPC1 | |
| SCHEMBL9662773 | 0.72 | F2 (0.39) | F2HTTHSD17B10SMN1; SMN2NPC1 | |
| SCHEMBL11143878 | 0.70 | — | — | |
| SCHEMBL10403239 | 0.67 | F2 (0.39) | F2HTTHSD17B10SMN1; SMN2NPC1 | |
| SCHEMBL2398675 | 0.66 | — | — | |
| SCHEMBL11590351 | 0.64 | TSHR (0.33) | TSHR | |
| SCHEMBL10403237 | 0.62 | F2 (0.39) | F2HTTHSD17B10SMN1; SMN2NPC1 | |
| SCHEMBL10726909 | 0.61 | — | — | |
| SCHEMBL8539040 | 0.56 | P2RX7 (0.38) | HTTSMN1; SMN2NPC1RAB9AL3MBTL1 | |
| SCHEMBL9711251 | 0.54 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8759268-B2 | Solution for removing residue after semiconductor dry process and method of removing the residue using the same | DAIKIN INDUSTRIES, LTD. (JP) | 2014-06-24 | — | — | US | disclosed |
| US-20100248486-A1 | SOLUTION FOR REMOVING RESIDUE AFTER SEMICONDUCTOR DRY PROCESS AND METHOD OF REMOVING THE RESIDUE USING THE SAME | DAIKIN INDUSTRIES, LTD. (JP) | 2010-09-30 | — | — | US | disclosed |