SCHEMBL28113681

SCHEMBL28113681

CCONC(CCC(=O)O)C(=O)O

nearest known ligand 0.52

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
FOLH1 Q04609 10/20 0.52
NAALAD2 Q9Y3Q0 2/20 0.52
RIMKLA Q8IXN7 1/20 0.52
GGH Q92820 1/20 0.49
GABRP O00591 2/20 0.42
GABRD O14764 2/20 0.42
GABRA1 P14867 2/20 0.42
GABRB1 P18505 2/20 0.42
GABRG2 P18507 2/20 0.42
GABRB3 P28472 2/20 0.42
GABRA5 P31644 2/20 0.42
GABRA3 P34903 2/20 0.42
GABRA2 P47869 2/20 0.42
GABRB2 P47870 2/20 0.42
GABRA4 P48169 2/20 0.42
GABRE P78334 2/20 0.42
GABRA6 Q16445 2/20 0.42
GABRG1 Q8N1C3 2/20 0.42
GABRG3 Q99928 2/20 0.42
GABRQ Q9UN88 2/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL19678634 0.85 FOLH1 (0.48) FOLH1NAALAD2RIMKLAGGHCYP1A2
SCHEMBL27597011 0.85 KMT2A (0.42) FOLH1NAALAD2RIMKLAGGH
SCHEMBL27597009 0.85 KMT2A (0.42) FOLH1NAALAD2RIMKLAGGH
D-Glutamate SCHEMBL27518411 0.85 ALOX15 (0.53) FOLH1NAALAD2RIMKLAGGHGABRP
SCHEMBL28008105 0.82 FOLH1 (0.53) FOLH1NAALAD2RIMKLAGGH
SCHEMBL28008104 0.82 FOLH1 (0.53) FOLH1NAALAD2RIMKLAGGH
SCHEMBL28528582 0.82 FOLH1 (0.46) FOLH1NAALAD2RIMKLAGGH
SCHEMBL27791865 0.81 KDM4E (0.38) FOLH1NAALAD2RIMKLAGGH
SCHEMBL31360784 0.80 CA2 (0.39)
SCHEMBL14948807 0.79 TGFBR1 (0.35) FOLH1NAALAD2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-110536977-A Electroless copper copper colloid catalyst liquid, electroless copper plating method and the manufacturing method for plating copper base ISHIHARA CHEMICAL CO LTD 2019-12-03 CN disclosed
CN-106414801-B Copper colloidal catalyst solution for electroless copper plating and electroless copper plating method 石原化学株式会社 2019-05-10 CN disclosed
CN-106414801-A Copper colloidal catalyst solution for electroless copper plating and electroless copper plating method 石原化学株式会社 2017-02-15 CN disclosed
CN-106132456-A Equipment, solution and method for sample collection 阿波根有限公司 2016-11-16 CN disclosed