SCHEMBL28115141

SCHEMBL28115141

CCCC(OCC)C(C)OCC

nearest known ligand 0.50

Predicted protein targets (top 4)

geneUniProtsupporting neighboursconfidence
LMNA P02545 1/20 0.50
THRB P10828 1/20 0.38
TSHR P16473 1/20 0.32
OPRM1 P35372 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4327461 0.85 TDP1 (0.41) LMNA
SCHEMBL2748508 0.79 LMNA (0.46) LMNATHRBTSHR
SCHEMBL4333790 0.79 TDP1 (0.49) LMNA
SCHEMBL14113756 0.78 LMNA (0.43) LMNATHRB
SCHEMBL10593354 0.76 LMNA (0.48) LMNATHRBTSHR
SCHEMBL7730742 0.75 LMNA (0.60) LMNATHRBOPRM1
SCHEMBL8433446 0.74 LMNA (0.39) LMNATHRB
SCHEMBL15256670 0.74 LMNA (0.39) LMNATHRB
SCHEMBL4326586 0.73 TDP1 (0.39) LMNAOPRM1
SCHEMBL30587691 0.72 LMNA (0.50) LMNATHRB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-104693784-B Polyamide compositions 朗盛德国有限责任公司 2017-05-24 CN claimed
CN-106349690-A PA/AS-based resin compound and preparation method thereof 上海金发科技发展有限公司 2017-01-25 CN claimed
CN-108047713-A Daiamid composition with good appearance 江苏金发科技新材料有限公司 2018-05-18 CN disclosed
CN-104448815-B A kind of thermoplastic resin composition and preparation method thereof 上海金发科技发展有限公司 2018-02-16 CN disclosed
CN-103597010-B Stable polyamide 罗地亚运作公司 2017-12-19 CN disclosed
CN-103168076-B Heat-staple daiamid composition 罗地亚经营管理公司 2017-07-28 CN disclosed
CN-106519663-A Flame-retardant and high temperature-resistant polyimide compound and preparation method thereof 上海金发科技发展有限公司 2017-03-22 CN disclosed