SCHEMBL2814681

SCHEMBL2814681

CC(C)COc1ccccc1C(=O)C(O)c1ccccc1

nearest known ligand 0.46

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
▸ ABCB1 P08183 12/20 0.46
▸ ALDH1A1 P00352 2/20 0.45
▸ TSHR P16473 2/20 0.45
▸ LMNA P02545 2/20 0.45
▸ CES2 O00748 1/20 0.45
▸ CES1 P23141 1/20 0.45
▸ HTT P42858 2/20 0.44
▸ USP2 O75604 1/20 0.44
▸ TP53 P04637 1/20 0.44
▸ GAA P10253 1/20 0.44
▸ THRB P10828 1/20 0.44
▸ ALOX15 P16050 1/20 0.44
▸ KMT2A Q03164 1/20 0.44
▸ PARP1 P09874 1/20 0.44
▸ ADRB1 P08588 1/20 0.42
▸ ADRB3 P13945 1/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL17846646 0.85 LMNA (0.45) ABCB1ALDH1A1TSHRLMNACES2
SCHEMBL251617 0.85 NPSR1 (0.53) ALDH1A1LMNACES2CES1HTT
Isopropylbenzene SCHEMBL27702611 0.83 NPSR1 (0.49) ALDH1A1LMNACES2CES1HTT
SCHEMBL20506072 0.82 KMT2A (0.50) ABCB1ALDH1A1LMNACES2CES1
SCHEMBL27860465 0.82 LMNA (0.47) ABCB1ALDH1A1TSHRLMNACES2
SCHEMBL5892091 0.82 L3MBTL1 (0.50) ALDH1A1LMNACES2CES1HTT
SCHEMBL17363854 0.81 LMNA (0.44) ABCB1ALDH1A1TSHRLMNACES2
SCHEMBL2819531 0.81 KMT2A (0.54) ALDH1A1TSHRLMNATP53KMT2A
SCHEMBL477006 0.81 ALDH1A1 (0.59) ABCB1ALDH1A1TSHRLMNAHTT
SCHEMBL5844753 0.81 SGMS2 (0.55) ALDH1A1LMNAHTTGAAKMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 48 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117120925-A Photosensitive laminate and method for manufacturing circuit board using the same 可隆工业株式会社 2023-11-24 — — CN disclosed
CN-116981998-A Photosensitive laminate and method for manufacturing circuit board using the same 可隆工业株式会社 2023-10-31 — — CN disclosed
CN-116964527-A Photosensitive laminate and method for manufacturing circuit board using the same 可隆工业株式会社 2023-10-27 — — CN disclosed
CN-116783549-A Photosensitive laminate, method of manufacturing photosensitive laminate, and method of manufacturing circuit board using the same 可隆工业株式会社 2023-09-19 — — CN disclosed
CN-116745698-A Photosensitive laminate, method for producing photosensitive laminate, and method for producing circuit board 可隆工业株式会社 2023-09-12 — — CN disclosed
CN-116724273-A Photosensitive laminate, method for producing photosensitive laminate, and method for producing circuit board 可隆工业株式会社 2023-09-08 — — CN disclosed
CN-116547320-A Photosensitive element, dry film photoresist, resist pattern, circuit board and display device using the same 可隆工业株式会社 2023-08-04 — — CN disclosed
WO-2022211457-A1 PHOTOSENSITIVE LAMINATE AND METHOD OF MANUFACTURING CIRCUIT BOARD 코오롱인더스트리 주식회사 2022-10-06 — — WO disclosed
WO-2022211453-A1 PHOTOSENSITIVE LAMINATE, METHOD FOR MANUFACTURING PHOTOSENSITIVE LAMINATE, AND METHOD FOR MANUFACTURING CIRCUIT BOARD 코오롱인더스트리 주식회사 2022-10-06 — — WO disclosed
WO-2022211456-A1 PHOTOSENSITIVE LAMINATE, AND CIRCUIT BOARD MANUFACTURING METHOD 코오롱인더스트리 주식회사 2022-10-06 — — WO disclosed
WO-2004023212-A1 PHOTOPOLYMERIZABLE RESIN COMPOSITION FOR SANDBLAST RESIST KOLON INDUSTRIES INC. (KR) 2004-03-18 — — WO disclosed
CN-1082679-C Photosensitive resin composition for sandblast resist MATSUSHITA ELECTRIC CORP (JP) 2002-04-10 — — CN disclosed
EP-0741332-B1 Photosensitive resin composition for sandblast resist MATSUSHITA ELECTRONICS CORP (JP) 2000-08-09 — — EP disclosed
US-5924912-A Photosensitive resin composition for sandblast resist MATSUSHITA ELECTRONICS CORPORATION (JP) 1999-07-20 — — US disclosed
US-5916738-A Photosensitive resin composition for sandblast resist MATSUSHITA ELECTRONICS CORPORATION (JP) 1999-06-29 — — US disclosed
US-5756261-A A CURABLE PHOTORESISTS BLENDS COMPRISING A POLYETHERURETHANE OR A POLYESTERURETHANE COPOLYMER WITH AN ACRYLIC COPOLYMER AND CARBOXY GROUP-CONTAINING CELLULOSE, A PHOTOINITIATOR; ADHESION, FLEXIBILITY, ELASTICITY MATSUSHITA ELECTRONICS CORPORATION (JP) 1998-05-26 — — US disclosed
CN-1140843-A Photosensitive resin composition for sandblast resist MATSUSHITA ELECTRIC CORP (JP) 1997-01-22 — — CN disclosed
EP-0741332-A1 Photosensitive resin composition for sandblast resist MATSUSHITA ELECTRONICS CORPORATION (JP) 1996-11-06 — — EP disclosed
US-4124389-A REVERSIBLY GELLED THE DOW CHEMICAL COMPANY (US) 1978-11-07 — — US disclosed
US-4072529-A PRINTING PLATES THE DOW CHEMICAL COMPANY (US) 1978-02-07 — — US disclosed
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