SCHEMBL28165477

SCHEMBL28165477

COCc1cc(C)cc(CN)c1O

nearest known ligand 0.44

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 4/20 0.44
PRKCE Q02156 3/20 0.44
MYLK Q15746 2/20 0.44
MAPT P10636 2/20 0.44
MEN1 O00255 1/20 0.44
PRKCG P05129 1/20 0.44
PRKCA P17252 1/20 0.44
APEX1 P27695 1/20 0.44
RECQL P46063 1/20 0.44
KMT2A Q03164 1/20 0.44
TDP1 Q9NUW8 1/20 0.44
AMY1A P0DUB6 1/20 0.39
CYP2C9 P11712 2/20 0.38
CYP2C19 P33261 2/20 0.38
HIF1A Q16665 2/20 0.38
SMN1; SMN2 Q16637 1/20 0.38
KDM4E B2RXH2 3/20 0.37
LMNA P02545 2/20 0.36
GAA P10253 2/20 0.36
HSPA5 P11021 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2115983 0.90 ALDH1A1 (0.52) ALDH1A1PRKCEMYLKMAPTMEN1
SCHEMBL15966095 0.85 AMY1A (0.48) ALDH1A1MAPTAPEX1RECQLKMT2A
SCHEMBL210222 0.84 AMY1A (0.55) ALDH1A1PRKCEMYLKMAPTMEN1
SCHEMBL16850513 0.84 AMY1A (0.55) ALDH1A1PRKCEMYLKMAPTMEN1
SCHEMBL13140673 0.82 PRKCE (0.46) ALDH1A1PRKCEMYLKMAPTMEN1
SCHEMBL16865573 0.82 PRKCE (0.46) ALDH1A1PRKCEMYLKMAPTMEN1
SCHEMBL10070498 0.82 PRKCE (0.48) ALDH1A1PRKCEMYLKMAPTMEN1
SCHEMBL22561789 0.81 ALDH1A1 (0.44) ALDH1A1PRKCEMYLKMAPTMEN1
SCHEMBL12697425 0.80 ALDH1A1 (0.57) ALDH1A1PRKCEMYLKMAPTMEN1
SCHEMBL6560610 0.79 ALDH1A1 (0.52) ALDH1A1MAPTTDP1AMY1ACYP2C9

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-107077070-A The manufacture method of photosensitive polymer combination, cured film, the element for possessing cured film and semiconductor devices 东丽株式会社 2017-08-18 CN disclosed