SCHEMBL2115983

SCHEMBL2115983

COCc1cc(C)cc(COC)c1O

nearest known ligand 0.52

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 5/20 0.52
PRKCE Q02156 3/20 0.52
MAPT P10636 3/20 0.52
MYLK Q15746 2/20 0.52
APEX1 P27695 2/20 0.52
RECQL P46063 2/20 0.52
KMT2A Q03164 2/20 0.52
MEN1 O00255 1/20 0.52
PRKCG P05129 1/20 0.52
PRKCA P17252 1/20 0.52
TDP1 Q9NUW8 1/20 0.52
AMY1A P0DUB6 1/20 0.45
CYP2C9 P11712 2/20 0.44
CYP2C19 P33261 2/20 0.44
HIF1A Q16665 2/20 0.44
SMN1; SMN2 Q16637 2/20 0.44
HSPA5 P11021 1/20 0.41
SELL P14151 1/20 0.40
SELP P16109 1/20 0.40
SELE P16581 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL16850513 0.94 AMY1A (0.55) ALDH1A1PRKCEMAPTMYLKAPEX1
SCHEMBL210222 0.94 AMY1A (0.55) ALDH1A1PRKCEMAPTMYLKAPEX1
SCHEMBL16865573 0.92 PRKCE (0.46) ALDH1A1PRKCEMAPTMYLKAPEX1
SCHEMBL13140673 0.92 PRKCE (0.46) ALDH1A1PRKCEMAPTMYLKAPEX1
SCHEMBL10070498 0.91 PRKCE (0.48) ALDH1A1PRKCEMAPTMYLKAPEX1
SCHEMBL22561789 0.90 ALDH1A1 (0.44) ALDH1A1PRKCEMAPTMYLKAPEX1
SCHEMBL28165477 0.90 ALDH1A1 (0.44) ALDH1A1PRKCEMAPTMYLKAPEX1
SCHEMBL12697425 0.89 ALDH1A1 (0.57) ALDH1A1PRKCEMAPTMYLKAPEX1
SCHEMBL19421993 0.88 AMY1A (0.50) ALDH1A1PRKCEMAPTMYLKAPEX1
SCHEMBL10114746 0.88 PRKCE (0.43) ALDH1A1PRKCEMAPTMYLKAPEX1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 603 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-120143554-A Positive photosensitive resin composition 万华化学集团股份有限公司 2025-06-13 CN claimed
CN-117806123-B Chemical amplification type negative photosensitive polyimide composition and application thereof 明士(北京)新材料开发有限公司 2024-05-31 CN claimed
CN-117806123-A Chemical amplification type negative photosensitive polyimide composition and application thereof 明士(北京)新材料开发有限公司 2024-04-02 CN claimed
CN-115561966-B Chemical amplification type negative photosensitive polyimide coating adhesive and application thereof 明士(北京)新材料开发有限公司 2023-05-16 CN claimed
CN-115561966-A Chemical amplification type negative photosensitive polyimide coating adhesive and application 明士(北京)新材料开发有限公司 2023-01-03 CN claimed
CN-114874441-A Chemical amplification type positive photosensitive polyimide coating adhesive and preparation method and application thereof 明士(北京)新材料开发有限公司 2022-08-09 CN claimed
CN-114488690-A Chemical amplification type negative polyimide photoresist and preparation method and application thereof 中国科学院化学研究所 2022-05-13 CN claimed
CN-111522200-B Negative PSPI resin for 12-inch silicon wafer and preparation method and application thereof 中国科学院化学研究所 2021-07-27 CN claimed
CN-111522200-A Negative PSPI resin for 12-inch silicon wafer and preparation method and application thereof 中国科学院化学研究所 2020-08-11 CN claimed
EP-1806618-B1 POSITIVE PHOTOSENSITIVE INSULATING RESIN COMPOSITION AND CURED PRODUCT THEREOF JSR CORP (JP) 2010-06-09 EP claimed
CN-122055676-A Resin composition, cured product, display device, or semiconductor device 东丽株式会社 2026-05-15 CN disclosed
EP-3893054-B1 PATTERN FORMING METHOD, PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, AND DEVICE FUJIFILM CORP (JP) 2026-05-06 EP disclosed
EP-3633455-B1 PHOTOSENSITIVE RESIN COMPOSITION, POLYMERIC PRECURSOR, CURED FILM, LAMINATE, CURED FILM PRODUCTION METHOD, AND SEMICONDUCTOR DEVICE FUJIFILM CORP (JP) 2026-04-08 EP disclosed
US-12529958-B2 Photosensitive resin composition, method for producing resin film having pattern, resin film having pattern, and semiconductor circuit substrate JSR CORPORATION (JP) 2026-01-20 US disclosed
US-20250382492-A1 LAMINATE, METHOD FOR MANUFACTURING LAMINATE, HOLLOW STRUCTURE, AND ELECTRONIC COMPONENT TORAY INDUSTRIES, INC. (JP) 2025-12-18 US disclosed
US-20030194631-A1 Precursor composition for positive photosensitive resin and display made with the same TORAY INDUSTRIES, INC. (JP) 2003-10-16 US disclosed
US-6593043-B2 Polyamic acid ester and/or a polyamic acid having specific end groups; compound having a phenolic hydroxyl group; and a quinonediazide sulfonate. TORAY INDUSTRIES, INC. (JP) 2003-07-15 US disclosed
US-20020090564-A1 Polyamic acid ester and/or a polyamic acid having specific end groups; compound having a phenolic hydroxyl group; and a quinonediazide sulfonate. TORAY INDUSTRIES, INC. (JP) 2002-07-11 US disclosed
EP-1209523-A2 Composition of positive photosensitive resin precursor, and display device made thereof TORAY INDUSTRIES, INC. (JP) 2002-05-29 EP disclosed
EP-0298393-A2 Process for producing negative images from positive photoresists containing curcumin and a light-sensitive material containing curcumin HOECHST CELANESE CORPORATION (US) 1989-01-11 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-12529958-B2 Photosensitive resin composition, method for producing resin film having pattern, resin film having pattern, and semiconductor circuit substrate RER1, ASH2L, ASIC1 ALDH1A1 689/4885PRKCE 2579/4885MAPT 2830/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.