Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | AMY1A | P0DUB6 | 1/20 | 0.55 |
| ▸ | CYP2C9 | P11712 | 3/20 | 0.53 |
| ▸ | CYP2C19 | P33261 | 3/20 | 0.53 |
| ▸ | HIF1A | Q16665 | 3/20 | 0.53 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.53 |
| ▸ | HSPA5 | P11021 | 1/20 | 0.50 |
| ▸ | HSD17B10 | Q99714 | 2/20 | 0.47 |
| ▸ | CYP2D6 | P10635 | 1/20 | 0.47 |
| ▸ | PRKCE | Q02156 | 3/20 | 0.47 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.47 |
| ▸ | MYLK | Q15746 | 2/20 | 0.47 |
| ▸ | MAPT | P10636 | 2/20 | 0.47 |
| ▸ | MEN1 | O00255 | 1/20 | 0.47 |
| ▸ | PRKCG | P05129 | 1/20 | 0.47 |
| ▸ | PRKCA | P17252 | 1/20 | 0.47 |
| ▸ | APEX1 | P27695 | 1/20 | 0.47 |
| ▸ | RECQL | P46063 | 1/20 | 0.47 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.47 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.47 |
| ▸ | SELL | P14151 | 1/20 | 0.36 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL16850513 | 1.00 | AMY1A (0.55) | AMY1ACYP2C9CYP2C19HIF1ASMN1; SMN2 | |
| SCHEMBL19421993 | 0.94 | AMY1A (0.50) | AMY1ACYP2C9CYP2C19HIF1ASMN1; SMN2 | |
| SCHEMBL2115983 | 0.94 | ALDH1A1 (0.52) | AMY1ACYP2C9CYP2C19HIF1ASMN1; SMN2 | |
| SCHEMBL15436831 | 0.93 | AMY1A (0.49) | AMY1ACYP2C9CYP2C19HIF1ASMN1; SMN2 | |
| SCHEMBL22222032 | 0.93 | AMY1A (0.49) | AMY1ACYP2C9CYP2C19HIF1ASMN1; SMN2 | |
| SCHEMBL12418952 | 0.89 | AMY1A (0.46) | AMY1ACYP2C9CYP2C19HIF1ASMN1; SMN2 | |
| SCHEMBL19600593 | 0.89 | AMY1A (0.46) | AMY1ACYP2C9CYP2C19HIF1ASMN1; SMN2 | |
| SCHEMBL16865573 | 0.86 | PRKCE (0.46) | AMY1ACYP2C9CYP2C19HIF1ASMN1; SMN2 | |
| SCHEMBL13140673 | 0.86 | PRKCE (0.46) | AMY1ACYP2C9CYP2C19HIF1ASMN1; SMN2 | |
| SCHEMBL5521164 | 0.85 | PRKCE (0.45) | AMY1ACYP2C9CYP2C19HIF1ASMN1; SMN2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 46 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20230350305-A1 | MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND TREATMENT LIQUID | FUJIFILM CORPORATION (JP) | 2023-11-02 | — | — | US | disclosed |
| US-20230298923-A1 | MULTILAYER BODY, RELEASE AGENT COMPOSITION, AND METHOD FOR PRODUCING PROCESSED SEMICONDUCTOR SUBSTRATE | NISSAN CHEMICAL CORPORATION (JP) | 2023-09-21 | — | — | US | disclosed |
| US-20230298923-A1 | MULTILAYER BODY, RELEASE AGENT COMPOSITION, AND METHOD FOR PRODUCING PROCESSED SEMICONDUCTOR SUBSTRATE | NISSAN CHEMICAL CORPORATION (JP) | 2023-09-21 | — | — | US | disclosed |
| US-20230213858-A1 | MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE | FUJIFILM CORPORATION (JP) | 2023-07-06 | — | — | US | disclosed |
| US-20230143007-A1 | MULTILAYER OBJECT AND RELEASE AGENT COMPOSITION | NISSAN CHEMICAL CORPORATION (JP) | 2023-05-11 | — | — | US | disclosed |
| US-11048167-B2 | Positive photosensitive resin composition, patterned cured film production method, patterned cured film, and electronic component | HD MICROSYSTEMS, LTD. (JP) | 2021-06-29 | — | — | US | disclosed |
| US-10338468-B2 | Photosensitive resin composition, photosensitive resin laminate, resin pattern production method, cured film, and display device | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2019-07-02 | — | — | US | disclosed |
| US-20180074403-A1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNED CURED FILM PRODUCTION METHOD, PATTERNED CURED FILM, AND ELECTRONIC COMPONENT | HD MICROSYSTEMS, LTD. (JP) | 2018-03-15 | — | — | US | disclosed |
| US-20180074403-A1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNED CURED FILM PRODUCTION METHOD, PATTERNED CURED FILM, AND ELECTRONIC COMPONENT | HD MICROSYSTEMS, LTD. (JP) | 2018-03-15 | — | — | US | disclosed |
| EP-2133743-B1 | PHOTOSENSITIVE RESIN COMPOSITION, PROCESS FOR PRODUCING PATTERNED HARDENED FILM WITH USE THEREOF AND ELECTRONIC PART | HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD (JP) | 2018-01-24 | — | — | EP | disclosed |
| US-20090181224-A1 | NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD AND ELECTRONIC PARTS | HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. (JP) | 2009-07-16 | — | — | US | disclosed |
| US-20090181224-A1 | NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD AND ELECTRONIC PARTS | HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. (JP) | 2009-07-16 | — | — | US | disclosed |
| US-20090182175-A1 | METHOD FOR PRODUCING NEW POLYNUCLEAR POLY(FORMYLPHENOL) | HONSHU CHEMICAL INDUSTRY CO., LTD. (JP) | 2009-07-16 | — | — | US | disclosed |
| US-20090011364-A1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING PATTERN, AND ELECTRONIC PART | HATTORI TAKASHI | 2009-01-08 | — | — | US | disclosed |
| US-20090011364-A1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING PATTERN, AND ELECTRONIC PART | HATTORI TAKASHI | 2009-01-08 | — | — | US | disclosed |
| US-7435525-B2 | Positive photosensitive resin composition, method for forming pattern, and electronic part | HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. (JP) | 2008-10-14 | — | — | US | disclosed |
| US-7435525-B2 | Positive photosensitive resin composition, method for forming pattern, and electronic part | HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. (JP) | 2008-10-14 | — | — | US | disclosed |
| US-20070122733-A1 | Positive photosensitive resin composition, method for forming pattern, and electronic part | HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. (JP) | 2007-05-31 | — | — | US | disclosed |
| US-20070122733-A1 | Positive photosensitive resin composition, method for forming pattern, and electronic part | HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. (JP) | 2007-05-31 | — | — | US | disclosed |
| EP-1744213-A1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING PATTERN, AND ELECTRONIC COMPONENT | Hitachi Chemical DuPont Microsystems Ltd. (JP) | 2007-01-17 | — | — | EP | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-20090182175-A1 | METHOD FOR PRODUCING NEW POLYNUCLEAR POLY(FORMYLPHENOL) | PCBP1, FPR2, PNKP | AMY1A 2459/4885CYP2C9 2247/4885CYP2C19 2387/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.