⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL9225082 | 0.94 | GPR84 (0.34) | — | |
| SCHEMBL24981149 | 0.94 | GPR84 (0.34) | — | |
| SCHEMBL9222918 | 0.84 | TSHR (0.42) | — | |
| SCHEMBL10689879 | 0.84 | CYSLTR2 (0.32) | — | |
| SCHEMBL9228342 | 0.83 | CYSLTR2 (0.36) | — | |
| SCHEMBL28403192 | 0.82 | CYSLTR2 (0.35) | — | |
| SCHEMBL27635807 | 0.78 | FFAR1 (0.33) | — | |
| SCHEMBL2611045 | 0.77 | GABRA1 (0.39) | — | |
| SCHEMBL11151068 | 0.77 | CYP1A2 (0.30) | — | |
| SCHEMBL8208195 | 0.74 | P2RX7 (0.34) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 149 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20260042976-A1 | COMPOSITIONS AND METHODS OF USE THEREOF | FUJIFILM ELECTRONIC MAT USA INC (US) | 2026-02-12 | — | — | US | claimed |
| EP-4381022-A1 | COMPOSITIONS AND METHODS OF USE THEREOF | FUJIFILM Electronic Materials U.S.A., Inc. (US) | 2024-06-12 | — | — | EP | claimed |
| US-20240034958-A1 | COMPOSITIONS AND METHODS OF USE THEREOF | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2024-02-01 | — | — | US | claimed |
| US-20230052829-A1 | COMPOSITIONS AND METHODS OF USE THEREOF | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. | 2023-02-16 | — | — | US | claimed |
| WO-2023014565-A1 | COMPOSITIONS AND METHODS OF USE THEREOF | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2023-02-09 | — | — | WO | claimed |
| CN-106460196-A | Etching composition | 富士胶片电子材料美国有限公司 | 2017-02-22 | — | — | CN | claimed |
| CN-105849245-A | Cleaning formulations for removing residues on surfaces | 富士胶片电子材料美国有限公司 | 2016-08-10 | — | — | CN | claimed |
| CN-102318042-B | Polishing agent for polishing copper and polishing method using same | HITACHI CHEMICAL CO LTD | 2015-07-01 | — | — | CN | claimed |
| CN-100543124-C | Substrate is with clean-out system and purging method | WAKO PURE CHEM IND LTD (JP) | 2009-09-23 | — | — | CN | claimed |
| CN-1902291-A | Polishing composition and polishing method | SHOWA DENKO KK (JP) | 2007-01-24 | — | — | CN | claimed |
| EP-4743526-A2 | POLISHING COMPOSITIONS AND METHODS OF USE THEREOF | FUJIFILM Electronic Materials U.S.A, Inc. (US) | 2026-05-20 | — | — | EP | disclosed |
| US-12630744-B2 | Polishing compositions and methods of use thereof | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2026-05-19 | — | — | US | disclosed |
| US-20260117105-A1 | POLISHING COMPOSITION HAVING EXCELLENT STORAGE STABILITY AND METHOD FOR PRODUCING SAME | NISSAN CHEMICAL CORPORATION (JP) | 2026-04-30 | — | — | US | disclosed |
| US-20260042976-A1 | COMPOSITIONS AND METHODS OF USE THEREOF | FUJIFILM ELECTRONIC MAT USA INC (US) | 2026-02-12 | — | — | US | disclosed |
| EP-4688987-A1 | POLISHING COMPOSITIONS AND METHODS OF USE THEREOF | FUJIFILM Electronic Materials U.S.A, Inc. (US) | 2026-02-11 | — | — | EP | disclosed |
| CN-1122655-C | improved metal-ligand complex catalyzed processes | UNION CARBIDE CHEM PLASTIC (US) | 2003-10-01 | — | — | CN | disclosed |
| US-6562719-B2 | Methods of polishing, interconnect-fabrication, and producing semiconductor devices | HITACHI, LTD. (JP) | 2003-05-13 | — | — | US | disclosed |
| CN-1392215-A | Metal polishing liquid material, metal polishing liquid, method for producing same, and polishing method using same | HITACHI CHEMICAL CO LTD (JP) | 2003-01-22 | — | — | CN | disclosed |
| US-20020016073-A1 | Methods of polishing, interconnect-fabrication, and producing semiconductor devices | HITACHI, LTD. | 2002-02-07 | — | — | US | disclosed |
| CN-1220652-A | improved metal-ligand complex catalyzed processes | UNION CARBIDE CHEM PLASTIC (US) | 1999-06-23 | — | — | CN | disclosed |