SCHEMBL2826341

SCHEMBL2826341

CC(O)CC(C(C)(C)O)C(C)(C)O

nearest known ligand 0.38

Predicted protein targets (top 5)

geneUniProtsupporting neighboursconfidence
MAPK1 P28482 1/20 0.38
TSHR P16473 3/20 0.37
TDP1 Q9NUW8 1/20 0.37
ALDH1A1 P00352 3/20 0.35
CYP2C19 P33261 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28379232 0.97 MAPK1 (0.36) MAPK1TSHRTDP1ALDH1A1
SCHEMBL3182014 0.79 MAPK1 (0.36) MAPK1TSHRTDP1ALDH1A1
SCHEMBL8578053 0.79 MAPK1 (0.36) MAPK1TSHRTDP1ALDH1A1
SCHEMBL2819665 0.75 TSHR (0.38) MAPK1TSHRTDP1ALDH1A1
SCHEMBL5369861 0.73 MAPK1 (0.36) MAPK1TSHRTDP1ALDH1A1
SCHEMBL9253938 0.73 ALDH1A1 (0.59) MAPK1TSHRTDP1ALDH1A1
SCHEMBL11788987 0.73 MAPK1 (0.32) MAPK1TSHRTDP1
SCHEMBL16074805 0.73 TDP1 (0.43) MAPK1TSHRTDP1ALDH1A1CYP2C19
SCHEMBL8623970 0.73 MAPK1 (0.32) MAPK1TSHRTDP1
SCHEMBL840436 0.71

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 34 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1317497-A4 POLYESTER RESINS WITH IMPROVED PROPERTIES POLYMERS AUSTRALIA PTY LTD (AU) 2005-03-02 EP claimed
US-20040116619-A1 Polyester resins with improved properties POLYMERS AUSTRALIA PTY LIMITED (AU) 2004-06-17 US claimed
EP-1317497-A1 POLYESTER RESINS WITH IMPROVED PROPERTIES Polymers Australia PTY Limited (AU) 2003-06-11 EP claimed
WO-2002022705-A1 POLYESTER RESINS WITH IMPROVED PROPERTIES POLYMERS AUSTRALIA PTY LTD (AU) 2002-03-21 WO claimed
CN-101313246-B Radiation-sensitive resin composition JSR CORP 2012-10-03 CN disclosed
US-8206888-B2 Radiation-sensitive resin composition JSR CORPORATION (JP) 2012-06-26 US disclosed
EP-1182506-B1 Crosslinked positive-working photoresist composition TOKYO OHKA KOGYO CO LTD (JP) 2010-10-27 EP disclosed
US-20100028800-A1 RADIATION-SENSITIVE RESIN COMPOSITION JSR CORPORATION (JP) 2010-02-04 US disclosed
CN-101313246-A Radiation-sensitive resin composition JSR CORP (JP) 2008-11-26 CN disclosed
EP-1953593-A1 RADIATION-SENSITIVE RESIN COMPOSITION JSR Corporation (JP) 2008-08-06 EP disclosed
US-7364831-B2 Positive resist composition and resist pattern formation method TOKYO OHKA KOGYO CO., LTD. (JP) 2008-04-29 US disclosed
US-20070004816-A1 Photocurable resin composition DSM IP ASSETS B.V. (NL) 2007-01-04 US disclosed
US-20020045133-A1 Method for the preparation of a semiconductor device TOKYO OHKA KOGYO CO., LTD. (JP) 2002-04-18 US disclosed
WO-2002022705-A1 POLYESTER RESINS WITH IMPROVED PROPERTIES POLYMERS AUSTRALIA PTY LTD (AU) 2002-03-21 WO disclosed
US-20020034704-A1 Crosslinked positive-working photoresist composition TOKYO OHKA KOGYO CO., LTD. (JP) 2002-03-21 US disclosed
EP-1182506-A1 Crosslinked positive-working photoresist composition TOKYO OHKA KOGYO CO., LTD. (JP) 2002-02-27 EP disclosed
US-6180316-B1 SUITABLE FOR USE AS CHEMICALLY AMPLIFIED RESIST USED IN MANUFACTURING OF INTEGRATED CIRCUITS JSR CORPORATION (JP) 2001-01-30 US disclosed
US-6120972-A COPOLYMER OF ACRYLIC ESTER AND CARBONATE WITH PHOTOACID GENERATOR FOR PHOTOSENSITIVE ELEMENTS JSR CORPORATION (JP) 2000-09-19 US disclosed
EP-0930541-A1 Radiation sensitive resin composition JSR Corporation (JP) 1999-07-21 EP disclosed
EP-0901043-A1 Radiation-sensitive resin composition JSR Corporation (JP) 1999-03-10 EP disclosed