SCHEMBL28274359

SCHEMBL28274359

CCC(c1ccc(N)c(C(=O)O)c1)c1ccc(N)c(C(=O)O)c1

nearest known ligand 0.53

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 7/20 0.53
KMT2A Q03164 6/20 0.53
GFER P55789 1/20 0.53
RXFP1 Q9HBX9 1/20 0.53
ALDH1A1 P00352 6/20 0.53
CDC25B P30305 1/20 0.53
CASP6 P55212 1/20 0.53
RCE1 Q9Y256 1/20 0.53
TDP1 Q9NUW8 6/20 0.52
MEN1 O00255 5/20 0.52
MCL1 Q07820 2/20 0.52
USP2 O75604 2/20 0.52
PKM P14618 2/20 0.52
POLB P06746 1/20 0.52
MAPT P10636 1/20 0.52
THRB P10828 1/20 0.52
APEX1 P27695 1/20 0.52
RECQL P46063 1/20 0.52
BLM P54132 1/20 0.52
GLA P06280 1/20 0.50

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4282493 0.86 ALDH1A1 (0.56) KDM4EKMT2AGFERRXFP1ALDH1A1
SCHEMBL22471781 0.86 ALDH1A1 (0.46) KDM4EKMT2AGFERRXFP1ALDH1A1
SCHEMBL254345 0.83 HSD17B10 (0.56) KDM4EKMT2AALDH1A1CDC25BTDP1
SCHEMBL31473042 0.83 HSD17B10 (0.56) KDM4EKMT2AALDH1A1CDC25BTDP1
SCHEMBL1793580 0.83 ALDH1A1 (0.44) KDM4EKMT2AGFERRXFP1ALDH1A1
SCHEMBL9860148 0.81 KDM4E (0.57) KDM4EKMT2AGFERRXFP1ALDH1A1
SCHEMBL4272723 0.81 KDM4E (0.57) KDM4EKMT2AGFERRXFP1ALDH1A1
SCHEMBL11090811 0.79 KMT2A (0.53) KDM4EKMT2AGFERRXFP1ALDH1A1
SCHEMBL648210 0.78 ALDH1A1 (0.72) KDM4EKMT2AGFERRXFP1ALDH1A1
SCHEMBL27531056 0.78 KEAP1 (0.58) KDM4EKMT2AGFERRXFP1ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-114174422-B Resin composition and use thereof DIC株式会社 2024-04-30 CN disclosed
CN-116847983-A Laminated structure and flexible printed circuit board 太阳控股株式会社 2023-10-03 CN disclosed
CN-116830039-A Photosensitive resin composition, photosensitive resin sheet, cured product, hollow structure, electronic component, and elastic wave filter 东丽株式会社 2023-09-29 CN disclosed
CN-114174422-A Resin composition, semiconductor sealing material using same, and dipping base material, circuit board, build-up film, prepreg, carbon fiber composite material, solder resist, dry film, and printed wiring board DIC株式会社 2022-03-11 CN disclosed
CN-113646882-A Photosensitive resin composition, photosensitive resin sheet, method for producing hollow structure, and electronic component 东丽株式会社 2021-11-12 CN disclosed
CN-105278241-B Photosensitive thermosetting resin composition, dry film and printed wiring board 太阳油墨制造株式会社 2020-08-11 CN disclosed
CN-105683837-B Photosensitive thermosetting resin composition and flexible printed circuit board 太阳油墨制造株式会社 2020-04-07 CN disclosed
CN-110869848-A Laminated structure, dry film, and flexible printed circuit board 太阳油墨制造株式会社 2020-03-06 CN disclosed
CN-105378564-B Photosensitive thermosetting resin composition and flexible printed circuit board 太阳油墨制造株式会社 2020-02-07 CN disclosed
CN-105683836-B Photosensitive heat curing resin combination and flexible printed circuit board 太阳油墨制造株式会社 2019-11-08 CN disclosed
CN-106463706-B Method for manufacturing electrode 宇部兴产株式会社 2019-06-18 CN disclosed
CN-106165164-B Method for manufacturing electrode 宇部兴产株式会社 2019-01-22 CN disclosed