Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | HSD17B10 | Q99714 | 6/20 | 0.42 |
| ▸ | TSHR | P16473 | 5/20 | 0.42 |
| ▸ | TTR | P02766 | 3/20 | 0.42 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.42 |
| ▸ | CYP3A4 | P08684 | 3/20 | 0.42 |
| ▸ | RECQL | P46063 | 3/20 | 0.42 |
| ▸ | THRB | P10828 | 3/20 | 0.39 |
| ▸ | ALOX15 | P16050 | 3/20 | 0.38 |
| ▸ | ALOX12 | P18054 | 3/20 | 0.38 |
| ▸ | SMN1; SMN2 | Q16637 | 3/20 | 0.38 |
| ▸ | HIF1A | Q16665 | 3/20 | 0.38 |
| ▸ | CYP1A2 | P05177 | 2/20 | 0.38 |
| ▸ | CYP2C19 | P33261 | 2/20 | 0.38 |
| ▸ | CYP2C9 | P11712 | 1/20 | 0.38 |
| ▸ | HPGD | P15428 | 4/20 | 0.34 |
| ▸ | MAPK1 | P28482 | 3/20 | 0.34 |
| ▸ | CASP1 | P29466 | 2/20 | 0.32 |
| ▸ | NR1I2 | O75469 | 2/20 | 0.32 |
| ▸ | NR1H2 | P55055 | 1/20 | 0.32 |
| ▸ | NR1H3 | Q13133 | 1/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL7029201 | 0.91 | MEN1 (0.38) | HSD17B10TSHRTTRALDH1A1CYP3A4 | |
| SCHEMBL29185432 | 0.78 | TSHR (0.43) | HSD17B10TSHRHPGDNR1H2NR1H3 | |
| SCHEMBL6844032 | 0.77 | HSD17B10 (0.46) | HSD17B10TSHRTTRALDH1A1CYP3A4 | |
| SCHEMBL5600053 | 0.77 | ALDH1A1 (0.50) | HSD17B10TSHRTTRALDH1A1CYP3A4 | |
| SCHEMBL2837831 | 0.76 | ESR1 (0.45) | TTRALDH1A1CYP3A4CYP1A2CYP2C19 | |
| SCHEMBL542204 | 0.76 | NR1H3 (0.44) | HSD17B10TSHRTTRALDH1A1CYP3A4 | |
| SCHEMBL28226604 | 0.72 | HSD17B10 (0.41) | HSD17B10TSHRTTRALDH1A1CYP3A4 | |
| SCHEMBL28429812 | 0.71 | KLF10 (0.36) | ALOX15CYP2C19MAPK1HTTKDM4E | |
| SCHEMBL28235804 | 0.70 | — | — | |
| SCHEMBL4457086 | 0.67 | HSD17B10 (0.50) | HSD17B10TSHRTTRALDH1A1CYP3A4 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 86 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-116144029-A | Organosilicon leveling agent, preparation method thereof, black matrix photosensitive resin composition, color filter and liquid crystal display device | 阜阳欣奕华材料科技有限公司 | 2023-05-23 | — | — | CN | claimed |
| CN-109634056-B | Photosensitive resin composition and method for producing substrate with resin film | 日铁化学材料株式会社 | 2024-07-09 | — | — | CN | disclosed |
| CN-118259550-A | Photosensitive resin composition, cured film, color filter, touch panel, and display device | 日铁化学材料株式会社 | 2024-06-28 | — | — | CN | disclosed |
| CN-117991589-A | Photosensitive resin composition for black resist, light shielding film, color filter, touch panel, and display device | 日铁化学材料株式会社 | 2024-05-07 | — | — | CN | disclosed |
| CN-117820197-A | Oxime ester initiator, black matrix photosensitive resin composition containing oxime ester initiator and application of black matrix photosensitive resin composition | 阜阳欣奕华材料科技有限公司 | 2024-04-05 | — | — | CN | disclosed |
| CN-108693704-B | Photosensitive resin composition, light shielding film, liquid crystal display device, and method for manufacturing light shielding film and liquid crystal display device | 日铁化学材料株式会社 | 2024-03-26 | — | — | CN | disclosed |
| CN-117192898-A | Photosensitive resin composition, cured film, display component, and display device | 日铁化学材料株式会社 | 2023-12-08 | — | — | CN | disclosed |
| CN-116954023-A | Negative photosensitive resin composition, cured film, and pattern cured film | 武汉柔显科技股份有限公司 | 2023-10-27 | — | — | CN | disclosed |
| CN-116893573-A | Photosensitive resin composition, cured film, substrate with cured film, and method for producing substrate with cured film | 日铁化学材料株式会社 | 2023-10-17 | — | — | CN | disclosed |
| CN-116893574-A | Substrate with cured film, photosensitive resin composition, method for producing substrate with cured film, and display device | 日铁化学材料株式会社 | 2023-10-17 | — | — | CN | disclosed |
| US-20080090177-A1 | Resin Composition Comprising Cardo Resin, Method for Forming Pattern Using the Resin Composition and Color Filter Using Pattern Formed by the Method | CHEIL INDUSTRIES INC. (KR) | 2008-04-17 | — | — | US | disclosed |
| US-20060102051-A1 | Photosensitive resin composition and curing product thereof | NIPPON KAYAKU KABUSHIKI KAISHA (JP) | 2006-05-18 | — | — | US | disclosed |
| WO-2006046733-A1 | THIOL COMPOUND, AND PHOTOSENSITIVE COMPOSITION AND BLACK MATRIX RESIST COMPOSITION USING THE COMPOUND | SHOWA DENKO K.K (JP) | 2006-05-04 | — | — | WO | disclosed |
| EP-1600812-A1 | PHOTOSENSITIVE RESIN COMPOSITION AND CURING PRODUCT THEREOF | Nippon Kayaku Kabushiki Kaisha (JP) | 2005-11-30 | — | — | EP | disclosed |
| US-6780549-B2 | PHOTOPOLYMERIZABLE UNSATURATED COMPOUND, A COMPOUND CONTAINING AN EPOXY GROUP, A PHOTOPOLYMERIZATION INITIATOR OR SENSITIZER, AND A SILICA SOL FILLER WITH A DIAMETER OF BETWEEN 5 NM-0.5 MU M | NIPPON STEEL CHEMICAL CO., LTD. (JP) | 2004-08-24 | — | — | US | disclosed |
| US-20020051942-A1 | Photo-or heat-curable resin composition and multilayer printed wiring board | NIPPON STEEL & SUMIKIN CHEMICAL CO., LTD. (JP) | 2002-05-02 | — | — | US | disclosed |
| EP-0646845-B1 | COLOR FILTER, MATERIAL THEREOF AND RESIN | NIPPON STEEL CORP (JP) | 2001-03-14 | — | — | EP | disclosed |
| US-5721076-A | A PHOTO OR THERMAL CURABLE, ALKALI-DEVELOPABLE PHOTOSENSITIVE POLYESTER MONOMERS CONTAINING ACRYLATED BISPHENOL EPOXY COMPOUNDS AND MONOANHYDIDE OR DIANHYDRIDE COMPOUNDS; | NIPPON STEEL CORPORATION (JP) | 1998-02-24 | — | — | US | disclosed |
| US-5710234-A | POLYORTHOESTERS FOR MOLDING MATERIALS, ADHESIVES AND HEAT RESISTANT POLYMERS | NIPPON STEEL CHEMICAL CO., LTD. (JP) | 1998-01-20 | — | — | US | disclosed |
| EP-0646845-A1 | COLOR FILTER, MATERIAL THEREOF AND RESIN | Nippon Steel Corporation (JP) | 1995-04-05 | — | — | EP | disclosed |