SCHEMBL28345930

SCHEMBL28345930

Oc1c(Br)cc(CCc2ccccc2)cc1Br

nearest known ligand 0.54

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CRHBP P24387 1/20 0.54
CRHR2 Q13324 1/20 0.54
PLAU P00749 1/20 0.47
TDP1 Q9NUW8 3/20 0.44
THRA P10827 1/20 0.44
THRB P10828 1/20 0.44
MEN1 O00255 1/20 0.44
HSP90AA1 P07900 1/20 0.44
MAPT P10636 1/20 0.44
KMT2A Q03164 1/20 0.44
LMNA P02545 1/20 0.42
IGF1R P08069 1/20 0.42
ALOX15 P16050 1/20 0.42
CYP3A4 P08684 1/20 0.42
TSHR P16473 1/20 0.42
MAOA P21397 2/20 0.42
MAOB P27338 2/20 0.42
FFAR1 O14842 1/20 0.42
DAO P14920 1/20 0.42
HDAC1 Q13547 2/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7873997 0.86 CYP3A4 (0.55) CRHBPCRHR2TDP1MEN1KMT2A
SCHEMBL6947008 0.83 PTPN1 (0.55) CRHBPCRHR2MEN1HSP90AA1MAPT
SCHEMBL12644423 0.79 TAAR1 (0.52) THRATHRBMAOBDAOHDAC1
SCHEMBL716420 0.77 IGF1R (0.55) TDP1IGF1RALOX15DAO
SCHEMBL2420912 0.77 CYP3A4 (0.50) CRHBPCRHR2TDP1MEN1KMT2A
SCHEMBL13903972 0.76 TDP1 (0.46) TDP1IGF1RALOX15MAOAMAOB
SCHEMBL4648373 0.75 ALDH1A1 (0.58) TDP1ALOX15MAOAMAOBFFAR1
Hydrogen Peroxide SCHEMBL10839871 0.75 TDP1 (0.71) TDP1ALOX15TSHRMAOAMAOB
Hydrogen Peroxide SCHEMBL10839772 0.75 TDP1 (0.71) TDP1ALOX15TSHRMAOAMAOB
Dihydropinosylvin SCHEMBL501070 0.75 LTA4H (0.70) TDP1MAPTIGF1RALOX15CYP3A4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-111087809-B Thermosetting resin composition, prepreg, metal foil laminate and printed wiring board using the same 台燿科技股份有限公司 2022-09-13 CN disclosed
CN-110591298-B Resin composition, and prepreg, metal foil laminate and printed wiring board produced using the same 台燿科技股份有限公司 2022-02-08 CN disclosed
CN-113412306-A Polyarylate resin composition and molded article using the same 尤尼吉可株式会社 2021-09-17 CN disclosed
CN-106661197-B Resin composition and laminate using same 尤尼吉可株式会社 2020-05-12 CN disclosed
CN-111087809-A Thermosetting resin composition, prepreg, metal foil laminate and printed wiring board using the same 台燿科技股份有限公司 2020-05-01 CN disclosed
CN-110591298-A Resin composition, and prepreg, metal foil laminate and printed wiring board produced using the same 台燿科技股份有限公司 2019-12-20 CN disclosed