SCHEMBL283517

SCHEMBL283517

c1cc(OCC2CO2)ccc1CCC(c1ccc(OCC2CO2)cc1)c1ccc(OCC2CO2)cc1

nearest known ligand 0.56

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TDP1 Q9NUW8 1/20 0.56
TP53 P04637 3/20 0.49
TSHR P16473 3/20 0.49
ALDH1A1 P00352 3/20 0.49
MAPT P10636 2/20 0.49
HPGD P15428 2/20 0.49
MEN1 O00255 2/20 0.49
KMT2A Q03164 2/20 0.49
HIF1A Q16665 2/20 0.49
PKM P14618 2/20 0.49
CYP1A2 P05177 1/20 0.49
PPARG P37231 1/20 0.49
LMNA P02545 1/20 0.49
GAA P10253 1/20 0.49
CYP3A4 P08684 1/20 0.46
SMN1; SMN2 Q16637 1/20 0.46
DRD4 P21917 3/20 0.39
GRM2 Q14416 1/20 0.39
HRH3 Q9Y5N1 4/20 0.38
FGFR1 P11362 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28635484 0.93 TDP1 (0.59) TDP1TP53TSHRALDH1A1MAPT
SCHEMBL9682444 0.86 TDP1 (0.61) TDP1TP53TSHRALDH1A1MAPT
SCHEMBL10430017 0.84 TDP1 (0.59) TDP1TP53TSHRALDH1A1MAPT
SCHEMBL10429965 0.84 TDP1 (0.59) TDP1TP53TSHRALDH1A1MAPT
SCHEMBL7789081 0.84 TDP1 (0.59) TDP1TP53TSHRALDH1A1MAPT
SCHEMBL3871705 0.84 TDP1 (0.66) TDP1TP53TSHRALDH1A1MAPT
SCHEMBL14517852 0.83 ALDH1A1 (0.54) TDP1TP53TSHRALDH1A1MAPT
SCHEMBL19056887 0.83 TDP1 (0.57) TDP1TP53TSHRALDH1A1MAPT
SCHEMBL7792952 0.82 TDP1 (0.65) TDP1TP53TSHRALDH1A1MAPT
SCHEMBL4431569 0.81 TDP1 (0.73) TDP1TP53TSHRALDH1A1MAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 273 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10920008-B2 Thermal-curable resin composition, and pre-preg, metal-clad laminate and printed circuit board manufactured using the same TAIWAN UNION TECHNOLOGY CORPORATION (TW) 2021-02-16 US claimed
US-20200123307-A1 THERMAL-CURABLE RESIN COMPOSITION, AND PRE-PREG, METAL-CLAD LAMINATE AND PRINTED CIRCUIT BOARD MANUFACTURED USING THE SAME TAIWAN UNION TECHNOLOGY CORPORATION (TW) 2020-04-23 US claimed
US-4654382-A TRIGLYCIDYL ETHER OF TRISPHENOL, POLYFUNCTIONAL EPOXY, AND THE REACTION PRODUCT OF AN AROMATIC, DIAMINE, DIVINYLDIS LOXANE, AND BISMALEIMIDE; CURING THE YOKOHAMA RUBBER CO., LTD. (JP) 1987-03-31 US claimed
US-4456653-A LIGHTWEIGHT METAL PISTON SUBSTITUTE CIBA-GEIGY CORPORATION (US) 1984-06-26 US claimed
US-12638772-B2 Resist underlayer film-forming composition NISSAN CHEMICAL CORPORATION (JP) 2026-05-26 US disclosed
US-12631964-B2 Resist underlayer film-forming composition NISSAN CHEMICAL CORPORATION (JP) 2026-05-19 US disclosed
US-12600811-B2 Crosslinking agent composition for water-compatible resin, and water-compatible resin composition NISSHINBO CHEMICAL INC. (JP) 2026-04-14 US disclosed
EP-4668315-A1 COMPOSITION FOR FORMING PROTECTIVE FILM FOR SEMICONDUCTOR CHIP MANUFACTURE, SEMICONDUCTOR SUBSTRATE, SEMICONDUCTOR CHIP, AND METHOD FOR MANUFACTURING SEMICONDUCTOR CHIP Nissan Chemical Corporation (JP) 2025-12-24 EP disclosed
EP-4083143-B1 CROSSLINKING AGENT COMPOSITION FOR WATER-COMPATIBLE RESIN, AND WATER-COMPATIBLE RESIN COMPOSITION NISSHINBO CHEMICAL INC (JP) 2025-12-24 EP disclosed
US-12488909-B2 Oxygen and moisture barrier compositions and related methods UNIVERSITY OF MASSACHUSETTS (US) 2025-12-02 US disclosed
US-20250361419-A1 COMPOSITION FOR FORMING COATING FILM FOR REMOVING FOREIGN MATTERS AND SEMICONDUCTOR SUBSTRATE NISSAN CHEMICAL CORPORATION (JP) 2025-11-27 US disclosed
US-12479960-B2 Triazine ring-containing polymer and film forming composition containing same NISSAN CHEMICAL CORPORATION (JP) 2025-11-25 US disclosed
EP-0810249-B1 Thermosetting resin composition, electrically insulated coil, electric rotating machine and method for producing same HITACHI LTD (JP) 2001-11-07 EP disclosed
US-5982056-A STATOR OF ROTATING MACHINE HITACHI, LTD. (JP) 1999-11-09 US disclosed
EP-0810249-A2 Thermosetting resin composition, electrically insulated coil, electric rotating machine and method for producing same HITACHI, LTD. (JP) 1997-12-03 EP disclosed
EP-0251431-B1 EPOXY RESIN MITSUI PETROCHEMICAL INDUSTRIES, LTD. (JP) 1993-07-28 EP disclosed
EP-0251431-A2 Epoxy resin MITSUI PETROCHEMICAL INDUSTRIES, LTD. (JP) 1988-01-07 EP disclosed
US-4654382-A TRIGLYCIDYL ETHER OF TRISPHENOL, POLYFUNCTIONAL EPOXY, AND THE REACTION PRODUCT OF AN AROMATIC, DIAMINE, DIVINYLDIS LOXANE, AND BISMALEIMIDE; CURING THE YOKOHAMA RUBBER CO., LTD. (JP) 1987-03-31 US disclosed
US-4505979-A METAL SHELL, CORE, FILLER, IMIDE RESIN CIBA-GEIGY CORPORATION (US) 1985-03-19 US disclosed
US-4456653-A LIGHTWEIGHT METAL PISTON SUBSTITUTE CIBA-GEIGY CORPORATION (US) 1984-06-26 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (3 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-12638772-B2 Resist underlayer film-forming composition RFC2, RFC1, RFC4 TDP1 1819/4885TP53 3982/4885TSHR 4320/4885
US-12600811-B2 Crosslinking agent composition for water-compatible resin, and water-compatible resin composition COL2A1, COL1A1, COL14A1 TDP1 2655/4885TP53 1389/4885TSHR 3165/4885
US-12631964-B2 Resist underlayer film-forming composition TET1, OGG1, TET3 TDP1 3750/4885TP53 4489/4885TSHR 3811/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.