Predicted protein targets (top 17)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | HTR1A | P08908 | 3/20 | 0.65 |
| ▸ | DRD2 | P14416 | 3/20 | 0.65 |
| ▸ | MGLL | Q99685 | 1/20 | 0.63 |
| ▸ | ABCB1 | P08183 | 8/20 | 0.56 |
| ▸ | PTGER1 | P34995 | 1/20 | 0.56 |
| ▸ | PTGER4 | P35408 | 1/20 | 0.56 |
| ▸ | PTGER3 | P43115 | 1/20 | 0.56 |
| ▸ | PTGER2 | P43116 | 1/20 | 0.56 |
| ▸ | BCHE | P06276 | 2/20 | 0.55 |
| ▸ | GAA | P10253 | 1/20 | 0.55 |
| ▸ | ABCG2 | Q9UNQ0 | 2/20 | 0.50 |
| ▸ | THRA | P10827 | 1/20 | 0.50 |
| ▸ | THRB | P10828 | 1/20 | 0.50 |
| ▸ | MAPT | P10636 | 1/20 | 0.50 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.50 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.50 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.50 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL10956404 | 1.00 | HTR1A (0.65) | HTR1ADRD2MGLLABCB1PTGER1 | |
| SCHEMBL17197391 | 0.90 | HTR1A (0.79) | HTR1ADRD2MGLLABCB1PTGER1 | |
| SCHEMBL10784832 | 0.86 | HTR1A (0.73) | HTR1ADRD2MGLLABCB1PTGER1 | |
| SCHEMBL27297827 | 0.86 | LTB4R (0.54) | HTR1ADRD2BCHETHRATHRB | |
| SCHEMBL28476408 | 0.85 | ALOX5 (0.64) | HTR1ADRD2MGLLABCB1PTGER1 | |
| SCHEMBL1172065 | 0.84 | HTR1A (0.65) | HTR1ADRD2MGLLABCB1PTGER1 | |
| SCHEMBL27341183 | 0.83 | HTR1A (0.59) | HTR1ADRD2MGLLABCB1PTGER1 | |
| SCHEMBL6547809 | 0.83 | LTB4R (0.57) | THRATHRBMAPTL3MBTL1 | |
| SCHEMBL9489161 | 0.83 | LTB4R (0.57) | THRATHRBMAPTL3MBTL1 | |
| SCHEMBL6669407 | 0.83 | THRA (0.55) | THRATHRBMAPTL3MBTL1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 24 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-111718532-B | Resin composition, coated cable, and wire harness | 矢崎总业株式会社 | 2022-11-18 | — | — | CN | disclosed |
| CN-111148782-B | Prepreg, metal foil-clad laminate, and wiring board | 松下知识产权经营株式会社 | 2022-10-14 | — | — | CN | disclosed |
| CN-110366569-B | Resin composition, prepreg, film with resin, metal foil with resin, metal-foil-clad laminate, and wiring board | 松下知识产权经营株式会社 | 2022-07-22 | — | — | CN | disclosed |
| CN-110831761-B | Metal foil-clad laminate, metal foil with resin, and wiring board | 松下知识产权经营株式会社 | 2022-07-22 | — | — | CN | disclosed |
| CN-114555360-A | Copper-clad laminate, wiring board, and resin-attached copper foil | 松下知识产权经营株式会社 | 2022-05-27 | — | — | CN | disclosed |
| CN-114555357-A | Metal-clad laminate, wiring board, metal foil with resin, and resin composition | 松下知识产权经营株式会社 | 2022-05-27 | — | — | CN | disclosed |
| CN-114430752-A | Resin composition, prepreg, film with resin, metal foil with resin, metal-foil-clad laminate, and wiring board | 松下知识产权经营株式会社 | 2022-05-03 | — | — | CN | disclosed |
| CN-114423602-A | Resin composition, prepreg, film with resin, metal foil with resin, metal-foil-clad laminate, and wiring board | 松下知识产权经营株式会社 | 2022-04-29 | — | — | CN | disclosed |
| CN-114402032-A | Resin composition, prepreg, film with resin, metal foil with resin, metal-foil-clad laminate, and wiring board | 松下知识产权经营株式会社 | 2022-04-26 | — | — | CN | disclosed |
| CN-114207021-A | Resin composition, prepreg, film with resin, metal foil with resin, metal-foil-clad laminate, and wiring board | 松下知识产权经营株式会社 | 2022-03-18 | — | — | CN | disclosed |
| CN-113795377-A | Copper-clad laminate, resin-coated copper foil, and circuit board using same | 松下知识产权经营株式会社 | 2021-12-14 | — | — | CN | disclosed |
| CN-113574102-A | Prepreg, metal foil-clad laminate, and wiring board | 松下知识产权经营株式会社 | 2021-10-29 | — | — | CN | disclosed |
| CN-112805150-A | Metal-clad laminate, wiring board, metal foil with resin, and resin composition | 松下知识产权经营株式会社 | 2021-05-14 | — | — | CN | disclosed |
| CN-112789167-A | Copper-clad laminate, wiring board, and resin-attached copper foil | 松下知识产权经营株式会社 | 2021-05-11 | — | — | CN | disclosed |
| CN-112368311-A | Resin composition, prepreg, film with resin, metal foil with resin, metal-foil-clad laminate, and wiring board | 松下知识产权经营株式会社 | 2021-02-12 | — | — | CN | disclosed |
| CN-112020523-A | Resin composition, prepreg, film with resin, metal foil with resin, metal-foil-clad laminate, and wiring board | 松下知识产权经营株式会社 | 2020-12-01 | — | — | CN | disclosed |
| CN-111630076-A | Resin composition, prepreg, film with resin, metal foil with resin, metal-foil-clad laminate, and wiring board | 松下知识产权经营株式会社 | 2020-09-04 | — | — | CN | disclosed |
| CN-111148781-A | Prepreg, metal foil-clad laminate, and wiring board | 松下知识产权经营株式会社 | 2020-05-12 | — | — | CN | disclosed |
| CN-111148782-A | Prepreg, metal foil-clad laminate, and wiring board | 松下知识产权经营株式会社 | 2020-05-12 | — | — | CN | disclosed |
| CN-110831761-A | Metal-clad laminate, metal foil with resin, and wiring board | 松下知识产权经营株式会社 | 2020-02-21 | — | — | CN | disclosed |