SCHEMBL28427166

SCHEMBL28427166

Oc1ccc(C(OC(c2ccc(O)cc2)c2ccc(O)cc2)c2ccc(O)cc2)cc1

nearest known ligand 0.52

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ IDO1 P14902 1/20 0.52
▸ TDO2 P48775 1/20 0.52
▸ ESR1 P03372 11/20 0.50
▸ ESR2 Q92731 10/20 0.50
▸ PDCD1 Q15116 1/20 0.50
▸ CD274 Q9NZQ7 1/20 0.50
▸ ALOX15 P16050 3/20 0.47
▸ LMNA P02545 2/20 0.47
▸ CYP3A4 P08684 2/20 0.47
▸ MAPT P10636 2/20 0.47
▸ NFKB1 P19838 2/20 0.47
▸ HIF1A Q16665 2/20 0.47
▸ MEN1 O00255 2/20 0.47
▸ KMT2A Q03164 2/20 0.47
▸ KDM4E B2RXH2 2/20 0.47
▸ NPC1 O15118 1/20 0.47
▸ CA12 O43570 1/20 0.47
▸ GMNN O75496 1/20 0.47
▸ ALDH1A1 P00352 1/20 0.47
▸ CA1 P00915 1/20 0.47

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10981079 0.90 IDO1 (0.67) IDO1TDO2ESR1ESR2PDCD1
SCHEMBL4059207 0.88 ACHE (0.59) IDO1TDO2ESR1ESR2PDCD1
SCHEMBL4060097 0.79 ESR1 (0.48) ESR1ESR2ALOX15LMNACYP3A4
SCHEMBL2997923 0.78 ESR1 (0.52) IDO1TDO2ESR1ESR2PDCD1
SCHEMBL10454830 0.72 IDO1 (0.44) IDO1TDO2ESR1ESR2PDCD1
SCHEMBL11854013 0.72 SRC (0.44) IDO1TDO2ESR1ESR2PDCD1
SCHEMBL9479827 0.72 ESR1 (0.59) ESR1ESR2PDCD1CD274ALOX15
SCHEMBL40254 0.71 ESR1 (0.58) ESR1ESR2PDCD1CD274ALOX15
SCHEMBL31274990 0.71 ESR1 (0.58) ESR1ESR2PDCD1CD274ALOX15
SCHEMBL216712 0.71 ESR1 (0.58) ESR1ESR2PDCD1CD274ALOX15

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-107870516-B Positive photosensitive resin composition, patterned film and method for manufacturing bump 奇美实业股份有限公司 2022-08-02 — — CN disclosed
CN-111032720-B Resin, photosensitive resin composition, resin cured film, and image display device 昭和电工株式会社 2022-06-28 — — CN disclosed
CN-111268977-A Combination of ternary binder and waterborne epoxy resin system SIKA技术股份公司 2020-06-12 — — CN disclosed
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