SCHEMBL28447207

SCHEMBL28447207

CO[Si](OC)(OC)Oc1ccc(N)cc1

nearest known ligand 0.54

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TDP1 Q9NUW8 5/20 0.54
MAPK1 P28482 2/20 0.54
ALDH1A1 P00352 8/20 0.52
CYP3A4 P08684 2/20 0.52
TSHR P16473 2/20 0.46
APP P05067 2/20 0.43
NR4A1 P22736 1/20 0.43
MAPT P10636 6/20 0.43
TEAD4 Q15561 1/20 0.43
POLB P06746 1/20 0.41
SMN1; SMN2 Q16637 4/20 0.41
NPC1 O15118 2/20 0.41
HPGD P15428 2/20 0.41
RAB9A P51151 2/20 0.41
KDM4E B2RXH2 1/20 0.41
TP53 P04637 1/20 0.41
NFKB1 P19838 1/20 0.41
NFKB2 Q00653 1/20 0.41
RELA Q04206 1/20 0.41
HSD17B10 Q99714 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL20653104 0.85 ALDH1A1 (0.55) TDP1MAPK1ALDH1A1CYP3A4TSHR
SCHEMBL26025804 0.79 TEAD4 (0.64) TDP1MAPK1ALDH1A1CYP3A4TSHR
SCHEMBL20652992 0.78 TDP1 (0.38) TDP1MAPK1ALDH1A1CYP3A4TSHR
SCHEMBL28278933 0.78 MEN1 (0.42) TDP1MAPK1ALDH1A1CYP3A4TSHR
SCHEMBL10879582 0.76 HPGD (0.41) CYP3A4MAPTSMN1; SMN2NPC1HPGD
SCHEMBL5405657 0.76 TDP1 (0.54) TDP1MAPK1ALDH1A1CYP3A4TSHR
SCHEMBL28442169 0.76 KDM1A (0.46) TDP1MAPK1ALDH1A1CYP3A4TSHR
SCHEMBL2335338 0.75 TDP1 (0.52) TDP1MAPK1ALDH1A1CYP3A4TSHR
SCHEMBL357605 0.75 TDP1 (0.52) TDP1MAPK1ALDH1A1CYP3A4TSHR
SCHEMBL3996985 0.75 CA4 (0.50) TDP1ALDH1A1TSHRPOLBSMN1; SMN2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-116149140-B Positive photosensitive resin composition with high chemical resistance and preparation method and application thereof 明士(北京)新材料开发有限公司 2023-07-14 CN disclosed
CN-116149140-A Positive photosensitive resin composition with high chemical resistance and preparation method and application thereof 明士(北京)新材料开发有限公司 2023-05-23 CN disclosed
CN-110099974-B Composition for forming protective layer on substrate 日产化学株式会社 2022-02-25 CN disclosed
CN-111423813-B Composition for forming release layer and release layer 日产化学工业株式会社 2021-11-23 CN disclosed
CN-107406675-B Composition for forming release layer and release layer 日产化学工业株式会社 2020-11-06 CN disclosed
CN-111423813-A Composition for forming release layer and release layer 日产化学工业株式会社 2020-07-17 CN disclosed