Predicted protein targets (top 18)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MGLL | Q99685 | 12/20 | 0.60 |
| ▸ | FAAH | O00519 | 4/20 | 0.56 |
| ▸ | BRD4 | O60885 | 1/20 | 0.55 |
| ▸ | HSP90AA1 | P07900 | 4/20 | 0.55 |
| ▸ | PKM | P14618 | 2/20 | 0.55 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.55 |
| ▸ | NPSR1 | Q6W5P4 | 1/20 | 0.55 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.55 |
| ▸ | LTA4H | P09960 | 1/20 | 0.48 |
| ▸ | NR1H2 | P55055 | 1/20 | 0.48 |
| ▸ | BAX | Q07812 | 1/20 | 0.48 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.47 |
| ▸ | HTT | P42858 | 1/20 | 0.47 |
| ▸ | ATM | Q13315 | 1/20 | 0.47 |
| ▸ | MEN1 | O00255 | 1/20 | 0.45 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.45 |
| ▸ | ESR1 | P03372 | 1/20 | 0.45 |
| ▸ | ESR2 | Q92731 | 1/20 | 0.45 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL9491223 | 0.92 | MGLL (0.70) | MGLLFAAHHSP90AA1PKMALDH1A1 | |
| SCHEMBL487151 | 0.92 | MGLL (0.70) | MGLLFAAHHSP90AA1PKMALDH1A1 | |
| SCHEMBL29391228 | 0.92 | MGLL (0.70) | MGLLFAAHHSP90AA1PKMALDH1A1 | |
| SCHEMBL29754402 | 0.92 | MGLL (0.70) | MGLLFAAHHSP90AA1PKMALDH1A1 | |
| SCHEMBL2120468 | 0.88 | MGLL (0.77) | MGLLFAAHBRD4HSP90AA1PKM | |
| SCHEMBL2120164 | 0.88 | MGLL (0.72) | MGLLFAAHHSP90AA1PKMALDH1A1 | |
| SCHEMBL24119952 | 0.87 | MGLL (0.74) | MGLLFAAHBRD4HSP90AA1PKM | |
| SCHEMBL331306 | 0.87 | MGLL (0.64) | MGLLFAAHHSP90AA1PKMALDH1A1 | |
| SCHEMBL30793027 | 0.87 | MGLL (0.64) | MGLLFAAHHSP90AA1PKMALDH1A1 | |
| SCHEMBL4263923 | 0.86 | MGLL (0.73) | MGLLFAAHHSP90AA1PKMALDH1A1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 19 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-118139742-A | Resin-coated metal foil, printed wiring board, method for manufacturing the same, and semiconductor package | 株式会社力森诺科 | 2024-06-04 | — | — | CN | disclosed |
| CN-118104403-A | Curable adhesive composition, film-like adhesive, method for producing multilayer wiring board, and multilayer wiring board | 株式会社力森诺科 | 2024-05-28 | — | — | CN | disclosed |
| CN-117980415-A | Thermosetting resin composition and thermosetting article | 宝理塑料赢创有限公司 | 2024-05-03 | — | — | CN | disclosed |
| CN-117881738-A | Resin composition, prepreg, laminated board, resin film, printed circuit board, and semiconductor package | 株式会社力森诺科 | 2024-04-12 | — | — | CN | disclosed |
| CN-117882007-A | Photosensitive resin composition, photosensitive resin film, multilayer printed wiring board, semiconductor package, and method for producing multilayer printed wiring board | 株式会社力森诺科 | 2024-04-12 | — | — | CN | disclosed |
| CN-112313281-B | Thermosetting resin composition, prepreg, laminated board, printed wiring board, semiconductor package, and method for producing thermosetting resin composition | 株式会社力森诺科 | 2024-03-29 | — | — | CN | disclosed |
| CN-110982267-B | Thermosetting resin composition, method for producing same, prepreg, laminated board, and printed wiring board | 株式会社力森诺科 | 2024-03-08 | — | — | CN | disclosed |
| CN-117561309-A | Resin composition, resin film, printed circuit board, and semiconductor package | 株式会社力森诺科 | 2024-02-13 | — | — | CN | disclosed |
| CN-112585004-B | Copper foil processing method, copper foil, laminate, copper-clad laminate, printed wiring board, and high-speed communication module | 株式会社力森诺科 | 2023-11-03 | — | — | CN | disclosed |
| CN-113423754-B | Curable resin composition, cured product, acid-modified maleimide resin, and curing agent | DIC株式会社 | 2023-09-19 | — | — | CN | disclosed |
| CN-116685634-A | Resin composition, prepreg, laminated board, resin film, printed wiring board, and semiconductor package | 株式会社力森诺科 | 2023-09-01 | — | — | CN | disclosed |
| CN-116669958-A | Thermosetting resin composition, prepreg, laminated board, metal-clad laminated board, printed circuit board, and high-speed communication compatible module | 株式会社力森诺科 | 2023-08-29 | — | — | CN | disclosed |
| CN-114901751-A | Thermosetting resin composition, prepreg, laminate, printed wiring board, and semiconductor package | 昭和电工材料株式会社 | 2022-08-12 | — | — | CN | disclosed |
| CN-110494810-B | Conductive roller for electrophotographic apparatus | 住友理工株式会社 | 2022-04-29 | — | — | CN | disclosed |
| CN-113423754-A | Curable resin composition, cured product, acid-modified maleimide resin, and curing agent | DIC株式会社 | 2021-09-21 | — | — | CN | disclosed |
| CN-112585004-A | Copper foil treatment method, copper foil, laminate, copper-clad laminate, printed wiring board, and high-speed communication module | 昭和电工材料株式会社 | 2021-03-30 | — | — | CN | disclosed |
| CN-112423982-A | Copper-clad laminate, printed wiring board, semiconductor package, and method for manufacturing copper-clad laminate | 昭和电工材料株式会社 | 2021-02-26 | — | — | CN | disclosed |
| CN-112313281-A | Thermosetting resin composition, prepreg, laminate, printed wiring board, semiconductor package, and method for producing thermosetting resin composition | 昭和电工材料株式会社 | 2021-02-02 | — | — | CN | disclosed |
| CN-105602197-B | Resin composition, and prepreg, laminate, and printed wiring board using same | 昭和电工材料株式会社 | 2020-11-20 | — | — | CN | disclosed |