SCHEMBL28487551

SCHEMBL28487551

NC(N)(c1ccccc1)c1cccc(C(F)(F)F)c1C(F)(F)F

nearest known ligand 0.44

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 3/20 0.44
TSHR P16473 2/20 0.44
KCNN4 O15554 3/20 0.39
HSD11B1 P28845 1/20 0.39
POLB P06746 1/20 0.38
TDP1 Q9NUW8 1/20 0.38
L3MBTL1 Q9Y468 1/20 0.38
MAPK1 P28482 1/20 0.36
IDO1 P14902 4/20 0.36
CA1 P00915 1/20 0.35
CA2 P00918 1/20 0.35
CA5A P35218 1/20 0.35
CA9 Q16790 1/20 0.35
TDO2 P48775 2/20 0.35
KIF11 P52732 3/20 0.34
HPGD P15428 1/20 0.34
BACE1 P56817 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28336714 0.82 ALDH1A1 (0.46) ALDH1A1TSHRHSD11B1POLBTDP1
SCHEMBL2000756 0.80 HSD11B1 (0.46) ALDH1A1TSHRHSD11B1POLBTDP1
SCHEMBL10588770 0.78 TSHR (0.43) ALDH1A1TSHRKCNN4HSD11B1POLB
Lithium SCHEMBL5691154 0.78 HSD11B1 (0.44) ALDH1A1TSHRHSD11B1POLBTDP1
Phenol SCHEMBL28835876 0.75 CA12 (0.48) ALDH1A1TSHRHSD11B1TDP1IDO1
SCHEMBL7088402 0.73 CYP2C9 (0.49) ALDH1A1TSHRKCNN4HPGD
SCHEMBL12264177 0.72 KCNN4 (0.63) ALDH1A1TSHRKCNN4POLBTDP1
SCHEMBL30183271 0.72 CA2 (0.40) ALDH1A1TSHRKCNN4POLBTDP1
SCHEMBL20412806 0.70 HSD11B1 (0.43) ALDH1A1HSD11B1POLBTDP1L3MBTL1
SCHEMBL790403 0.70 HSD11B1 (0.40) ALDH1A1TSHRHSD11B1POLBTDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-112011308-B Composition, adhesive material, adhesive layer, adhesive sheet, copper foil, copper-clad laminate, wiring board, and method for producing same 荒川化学工业株式会社 2023-05-30 CN disclosed
CN-108690194-B Polyimide, adhesive material, adhesive layer, adhesive sheet, copper foil, copper-clad laminate, wiring board, and method for producing same 荒川化学工业株式会社 2022-11-01 CN disclosed
CN-108690193-B Polyimide, adhesive material, adhesive layer, adhesive sheet, copper foil, copper-clad laminate, wiring board, and method for producing same 荒川化学工业株式会社 2022-09-09 CN disclosed
CN-108690552-B Adhesive, adhesive material, adhesive layer, adhesive sheet, copper foil, copper-clad laminate, wiring board, and method for producing same 荒川化学工业株式会社 2022-04-19 CN disclosed
CN-107793991-B Copper-clad laminate for flexible printed wiring board, and flexible printed wiring board 荒川化学工业株式会社 2022-03-08 CN disclosed
CN-112011308-A Composition, adhesive material, adhesive layer, adhesive sheet, copper foil, copper-clad laminate, wiring board, and method for producing same 荒川化学工业株式会社 2020-12-01 CN disclosed