Predicted protein targets (top 9)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.34 |
| ▸ | HPGD | P15428 | 1/20 | 0.34 |
| ▸ | GRIA1 | P42261 | 1/20 | 0.33 |
| ▸ | CACNG8 | Q8WXS5 | 1/20 | 0.33 |
| ▸ | EGFR | P00533 | 2/20 | 0.32 |
| ▸ | LMNA | P02545 | 1/20 | 0.32 |
| ▸ | SRC | P12931 | 1/20 | 0.32 |
| ▸ | CSNK2A1 | P68400 | 1/20 | 0.31 |
| ▸ | CFTR | P13569 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL6039484 | 0.83 | — | — | |
| SCHEMBL29696957 | 0.80 | GPR84 (0.32) | — | |
| SCHEMBL30829735 | 0.78 | PARP1 (0.36) | ALDH1A1LMNA | |
| SCHEMBL1426960 | 0.77 | — | — | |
| SCHEMBL730353 | 0.77 | — | — | |
| SCHEMBL30002011 | 0.77 | — | — | |
| SCHEMBL284553 | 0.77 | GABRA1 (0.39) | ALDH1A1 | |
| SCHEMBL3107123 | 0.77 | — | — | |
| SCHEMBL3259921 | 0.77 | — | — | |
| SCHEMBL29466093 | 0.77 | GABRA1 (0.39) | ALDH1A1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2024010249-A1 | CMP SLURRY COMPOSITION FOR POLISHING COPPER BARRIER LAYER | 와이씨켐 주식회사 | 2024-01-11 | — | — | WO | claimed |
| WO-2010053388-A1 | NEW 4,6-DISUBSTITUTED 2-(4-METHYLPIPERAZIN-1-YL)PYRIDINE DERIVATIVES, A PROCESS FOR THEIR PREPARATION, PHARMACEUTICAL COMPOSITION CONTAINING THESE COMPOUNDS, THEIR USE, A METHOD FOR MODULATING MONOAMINERGIC RECEPTOR ACTIVITY AND A MONOAMINERGIC RECEPTOR MODULATING AGENT | INSTYTUT FARMAKOLOGII POLSKIEJ AKADEMII NAUK (PL) | 2010-05-14 | — | — | WO | claimed |
| US-20050005525-A1 | Non-polymeric organic particles for chemical mechanical planarization | DYNEA AUSTRIA GMBH (AT) | 2005-01-13 | — | — | US | claimed |
| EP-2958912-A1 | PYRIDINE DERIVATIVES AS 5-HT6 RECEPTOR ANTAGONISTS | SELVITA S.A. (PL) | 2015-12-30 | — | — | EP | disclosed |
| WO-2014128223-A1 | PYRIDINE DERIVATIVES AS 5-HT6 RECEPTOR ANTAGONISTS | SELVITA S.A. (PL) | 2014-08-28 | — | — | WO | disclosed |
| US-20120120146-A1 | Encapsulated Reactive Ink And Method For Forming Images Using Same | XEROX CORPORATION | 2012-05-17 | — | — | US | disclosed |
| EP-2427523-A1 | AN AQUEOUS METAL POLISHING AGENT COMPRISING A POLYMERIC ABRASIV CONTAINING PENDANT FUNCTIONAL GROUPS AND ITS USE IN A CMP PROCESS | BASF SE (DE) | 2012-03-14 | — | — | EP | disclosed |
| EP-2427522-A1 | AN AQUEOUS POLISHING AGENT COMPRISING SOLID POLYMER PARTICLES AND TWO COMPLEXING AGENTS AND ITS USE IN A PROCESS FOR POLISHING PATTERNED AND UNSTRUCTURED METAL SURFACES | BASF SE (DE) | 2012-03-14 | — | — | EP | disclosed |
| WO-2010127937-A1 | AN AQUEOUS METAL POLISHING AGENT COMPRISING A POLYMERIC ABRASIV CONTAINING PENDANT FUNCTIONAL GROUPS AND ITS USE IN A CMP PROCESS | BASF SE (DE) | 2010-11-11 | — | — | WO | disclosed |
| WO-2010127938-A1 | AN AQUEOUS POLISHING AGENT COMPRISING SOLID POLYMER PARTICLES AND TWO COMPLEXING AGENTS AND ITS USE IN A PROCESS FOR POLISHING PATTERNED AND UNSTRUCTURED METAL SURFACES | BASF SE (DE) | 2010-11-11 | — | — | WO | disclosed |
| WO-2010053388-A1 | NEW 4,6-DISUBSTITUTED 2-(4-METHYLPIPERAZIN-1-YL)PYRIDINE DERIVATIVES, A PROCESS FOR THEIR PREPARATION, PHARMACEUTICAL COMPOSITION CONTAINING THESE COMPOUNDS, THEIR USE, A METHOD FOR MODULATING MONOAMINERGIC RECEPTOR ACTIVITY AND A MONOAMINERGIC RECEPTOR MODULATING AGENT | INSTYTUT FARMAKOLOGII POLSKIEJ AKADEMII NAUK (PL) | 2010-05-14 | — | — | WO | disclosed |
| US-7037351-B2 | Non-polymeric organic particles for chemical mechanical planarization | DYNEA CHEMICALS OY (FI) | 2006-05-02 | — | — | US | disclosed |
| US-20050005525-A1 | Non-polymeric organic particles for chemical mechanical planarization | DYNEA AUSTRIA GMBH (AT) | 2005-01-13 | — | — | US | disclosed |
| US-6620215-B2 | Aqueous slurry containing resin particles comprised of form-aldehyde, melamine, urea, phenol and resorcinol function-alized components; tailored to selectively remove different contaminants from semiconductor surface | DYNEA CANADA, LTD. (CA) | 2003-09-16 | — | — | US | disclosed |
| US-20030136055-A1 | Abrasive composition containing organic particles for chemical mechanical planarization | DYNEA AUSTRIA GMBH (AT) | 2003-07-24 | — | — | US | disclosed |