SCHEMBL2852708

SCHEMBL2852708

Cc1cc(-c2ccccc2)c(N)c(C)c1N

nearest known ligand 0.44

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
PDE4A P27815 1/20 0.44
PDE4B Q07343 1/20 0.44
PDE4C Q08493 1/20 0.44
PDE4D Q08499 1/20 0.44
PDE3B Q13370 1/20 0.44
PDE3A Q14432 1/20 0.44
ESR2 Q92731 1/20 0.42
ALDH1A1 P00352 4/20 0.41
HSD17B10 Q99714 2/20 0.41
POLB P06746 2/20 0.41
TP53 P04637 1/20 0.41
CYP3A4 P08684 1/20 0.41
TSHR P16473 1/20 0.41
TDP1 Q9NUW8 1/20 0.41
CYP2A6 P11509 1/20 0.41
CYP2B6 P20813 1/20 0.41
MAPT P10636 2/20 0.40
DHFR P00374 1/20 0.40
KDM4E B2RXH2 3/20 0.39
AKT1 P31749 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27544380 0.88 ESR2 (0.42) PDE4APDE4BPDE4CPDE4DPDE3B
SCHEMBL28754177 0.88 PDE4A (0.44) PDE4APDE4BPDE4CPDE4DPDE3B
Hydrochloric Acid SCHEMBL28477097 0.86 PDE4A (0.43) PDE4APDE4BPDE4CPDE4DPDE3B
SCHEMBL2849079 0.83 ESR2 (0.42) PDE4APDE4BPDE4CPDE4DPDE3B
SCHEMBL2206286 0.83 ESR2 (0.42) PDE4APDE4BPDE4CPDE4DPDE3B
SCHEMBL28348785 0.82 CYP1A1 (0.42) PDE4APDE4BPDE4CPDE4DPDE3B
SCHEMBL25011920 0.81 HSD17B10 (0.43) PDE4APDE4BPDE4CPDE4DPDE3B
SCHEMBL9326316 0.81 ALDH1A1 (0.54) PDE4APDE4BPDE4CPDE4DPDE3B
SCHEMBL2312693 0.80 ESR2 (0.40) PDE4APDE4BPDE4CPDE4DPDE3B
SCHEMBL27595706 0.80 BACE1 (0.56) PDE4APDE4BPDE4CPDE4DPDE3B

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 47 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115911541-A Solid polymer electrolyte containing ionic liquid and preparation method thereof 中国科学院长春应用化学研究所 2023-04-04 CN claimed
CN-115882059-A In-situ polymerization solid polymer electrolyte and preparation method thereof 中国科学院长春应用化学研究所 2023-03-31 CN claimed
CN-115380058-B Imide-amic acid copolymer, process for producing the same, varnish, and polyimide film 三菱瓦斯化学株式会社 2024-07-09 CN disclosed
CN-114867767-B Polyimide resin, polyimide varnish and polyimide film 三菱瓦斯化学株式会社 2024-07-02 CN disclosed
CN-114729122-B Polyimide resin, polyimide varnish and polyimide film 三菱瓦斯化学株式会社 2024-06-18 CN disclosed
CN-118140601-A Resin composition, cured product, sheet, laminate, and printed wiring board 株式会社力森诺科 2024-06-04 CN disclosed
CN-115380059-B Imide-amic acid copolymer, process for producing the same, varnish, and polyimide film 三菱瓦斯化学株式会社 2024-05-24 CN disclosed
CN-116057109-B Polymer composition, varnish, and polyimide film 三菱瓦斯化学株式会社 2024-05-14 CN disclosed
CN-114096589-B Polyimide resin, polyimide varnish and polyimide film 三菱瓦斯化学株式会社 2024-03-08 CN disclosed
CN-113227206-B Imide-amic acid copolymer, process for producing the same, varnish, and polyimide film 三菱瓦斯化学株式会社 2024-03-08 CN disclosed
CN-113166412-B Polyimide resin, polyimide varnish and polyimide film 三菱瓦斯化学株式会社 2024-03-08 CN disclosed
CN-112601777-A Polyimide resin, polyimide varnish, and polyimide film 三菱瓦斯化学株式会社 2021-04-02 CN disclosed
CN-112041371-A Polyimide resin, polyimide varnish, and polyimide film 三菱瓦斯化学株式会社 2020-12-04 CN disclosed
US-10765008-B2 Metal clad laminate, preparation method thereof, and method for preparing flexible circuit board by using the same ETERNAL MATERIALS CO., LTD. (TW) 2020-09-01 US disclosed
CN-111465634-A Polyimide resin, polyimide varnish, and polyimide film 三菱瓦斯化学株式会社 2020-07-28 CN disclosed
CN-111164131-A Imide resin, polyimide varnish, and polyimide film 三菱瓦斯化学株式会社 2020-05-15 CN disclosed
US-10280334-B2 Polyimides, coating composition formed therefrom and use thereof ETERNAL MATERIALS CO., LTD. (TW) 2019-05-07 US disclosed
US-20160374208-A1 METAL CLAD LAMINATE, PREPARATION METHOD THEREOF, AND METHOD FOR PREPARING FLEXIBLE CIRCUIT BOARD BY USING THE SAME ETERNAL MATERIALS CO., LTD. (TW) 2016-12-22 US disclosed
US-20140228512-A1 POLYIMIDES, COATING COMPOSITION FORMED THEREFROM AND USE THEREOF ETERNAL CHEMICAL CO., LTD. (TW) 2014-08-14 US disclosed
US-20100086792-A1 POLYIMIDE PRECURSOR, ITS COMPOSITION AND POLYIMIDE LAMINATE ETERNAL CHEMICAL CO., LTD. (TW) 2010-04-08 US disclosed